Appendix A: Package Dimensions
R
30
Intel
®
845GE / 845PE Chipset (G)MCH Thermal Design Guide
Figure 13. Intel
®
(G)MCH FC-BGA Package Dimensions (Bottom View)
Pkg760_Bottom
Bottom View
Units = Millimeters
1.0000
0.435
AU
AT
AR
AP
AN
AM
AL
AK
AJ
AH
AG
AF
AE
AD
AC
AB
AA
Y
W
V
U
T
R
P
N
M
L
K
J
H
G
F
E
D
C
B
A
2
10
16
20
22
3
5
7
9
11
13
15
17
19
1
21
4
6
18
8
12
14
23
24
32
25
27
29
31
33
35
37
26
28
30
34
36
0.7500
0.7500
1.0000
Detail B
Detail A
ϕ
0.63 ±0.025
ϕ
0.47 ±0.04
0.7 ±0.05
0.57 ±0.1
0.57 ±0.1
0.7 ±0.05
0.7 ±0.05
Detail B
Pin A1
Detail A
S
B
A
L
0.203
BGA Land; 760 balls
ϕ
0.600 (760 places)
S
C
L
0.071
A
