80960HA/HD/HT
Datasheet
33
Table 14. Maximum T
A
at Various Airflows in °C (PQ4 Package Only)
Airflow-ft/min (m/sec)
f
CLKIN
(MHz)
0
(0)
200
(1.01)
400
(2.03)
600
(3.04)
800
(4.06)
1000
(5.07)
Core
1X Bus
Clock
T
A
with
Heatsink
†
25
33
40
71
67
63
76
74
71
79
77
75
79
77
75
80
79
77
80
79
77
T
A
without
Heatsink
25
33
40
70
65
61
73
68
65
75
72
69
75
72
69
76
74
71
76
74
71
Core
2X Bus
Clock
T
A
with
Heatsink
†
16
25
33
40
71
62
55
48
76
71
66
62
79
75
71
68
79
75
71
68
80
77
74
72
80
77
74
72
T
A
without
Heatsink
16
25
33
40
69
60
52
42
72
64
57
51
75
68
63
58
75
68
63
58
76
71
66
62
76
71
66
62
Core
3X Bus
Clock
T
A
with
Heatsink
†
20
25
58
51
68
64
73
70
73
70
76
73
76
73
T
A
without
Heatsink
20
25
56
48
61
55
66
61
66
61
68
64
68
64
†
0.285” high unidirectional heatsink (AI alloy 6061, 50 mil fin width, 150 mil center-to-center fin spacing).
Table 15. 80960Hx 208-Pin PQ4 Package Thermal Characteristics
Thermal Resistance — °C/Watt
Parameter
Airflow — ft./min (m/sec)
0
(0)
200
(1.01)
400
(2.03)
600
(3.07)
800
(4.06)
1000
(5.07)
θ
Junction-to-Case
(Case measured as
shown in
Figure 5
.)
1
1
1
1
1
1
θ
Case-to-Ambient
(No Heatsink)
12
10
8
8
7
7
θ
Case-to-Ambient
(With Heatsink)
3
11
7
5
5
4
4
NOTES:
1. This table applies to 80960Hx PQ4 plugged into socket or soldered directly to board.
2.
θ
JA
=
θ
JC
+
θ
CA
3. 0.285” high unidirectional heatsink (AI alloy 6061, 50 mil fin width, 150 mil center-to-center fin spacing).
θ
JC
θ
JA
