INGENIA Titan GO, Product Manual

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TITAN GO Product Manual | Dimensions and assembly
INGENIA | 2022-07-14 08:35:14 104
8.2.1 Heatsinks or cooling plates
In order to choose the cooling needs of the Titan, please see the thermal calculations in Product Description page.
Given the power ratings of the Titan, typically passive cooling heatsinks will not be enough for continouous
operation. Forced air or water cooling solutions are suggested. See some examples next:
Manufactu
rer Type Part
Number Thermal
resistance Dimensions Image
Wakefield-
Vette Liquid
cooling plate
with exposed
copper 120459 0.007°C/W
at 1.4 GPM
381.0 mm x 127.0 mm x
15.2 mm
(excluding heat exchanger
and pump)
Fischer
Elektronik Heatsink with
cooling fan at
24V LA 11
200 24 0.055°C/W 240 mm x 200 mm x 83
mm
8.2.2
Thermal interface material
Thermal interface materials for a cooling plate with a big surface should be tacky and soft to prevent the formation
of air bubbles. Also thickness should be enough to compensate for the flexion of the plate while being compressed,
0.5 mm is typically enough for this purpose.
Please note that thin "high performance" materials that look promising on the datasheet may end up with poor
heat transfer. With thin materials the pressure is only applied near the screws and air bubbles are formed,
decreasing the heat transfer dramatically.
Manufacturer Part Number and
description Thickness
before
compression Thermal
conductivity Estimated thermal
resistance plate to
heatsink
Laird
Technologies A15896-02
TFLEX 720 9X9"
0.50 mm 5.0 W/m·K 0.003 K/W
Laird
Technologies A15896-04
TFLEX 740 9X9
1.00 mm 5.0 W/m·K 0.005 K/W
You can have the highest performance cooling plate and not be capable of cooling the Titan if the
assembly is incorrect!
Please use appropriate thermal interface materials and follow the assembly instructions to achieve an
excellent heat transfer. See below
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