TLE9263BQXV33
General Product Characteristics
Data Sheet
16
Rev. 1.00, 2017-07-31
4.3
Thermal Resistance
Table 3
Thermal Resistance
1)
1) Not subject to production test, specified by design.
Parameter
Symbol
Values
Unit
Note /
Test Condition
Number
Min.
Typ.
Max.
Junction to Soldering Point
R
thJSP
–
6
–
K/W
Exposed Pad
P_4.3.1
Junction to Ambient
R
thJA
–
33
–
K/W
2)
2) According to Jedec JESD51-2,-5,-7 at natural convection on FR4 2s2p board for 1.5W. Board: 76.2x114.3x1.5mm³ with 2
inner copper layers (35µm thick), with thermal via array under the exposed pad contacting the first inner copper layer and
300mm2 cooling area on the bottom layer (70µm).
P_4.3.2
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