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Application Note

13

<Revision 2.4>

<<2019-06-17>>

Assembly Instructions for the Easy-PressFIT Modules

concentration is five times higher than the conditions according to the norm. The green fields show the test
conditions according to the norm, which is less critical than in the individual tests.

Figure 12

Extract from qualification test

Further details on the individual tests can be found in various publications, such as "Reliability of PressFIT
connections" at www.infineon.com.

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Summary of Contents for PressFIT

Page 1: ...cess 6 3 1 Press in tools 6 3 1 1 Press in tools for Easy modules with thermal interface material 7 3 2 Press in forces and speed 9 4 The press out process 10 4 1 Press out tools 10 4 2 Press out forc...

Page 2: ...as been used for decades in a wide variety of applications and has been adapted for use in the various modules The Easy PressFIT contact allows solderfree assembly of the EasyPIM EasyPACK and Easy Aut...

Page 3: ...e DCB is fully supported in the press tool and the press in forces affect the DCB and not the housing Figure 3 Forces on the housing during module handling should be avoided to prevent a push out of t...

Page 4: ...dhered to If the specification of PressFIT holes is limited to only the finished dimension i e the metallized hole different drill sizes could be used depending on the PCB manufacturer and production...

Page 5: ...m the middle of the pins to other components must be observed A distance of 5 mm is recommended similar to Infineon s Econo PressFIT power modules A PressFIT module can be replaced up to two times Thi...

Page 6: ...each other The pressure plate should be mechanically fixed in position without any tolerance The module is then pressed into the PCB in a regular motion The module pins should penetrate the PCB durin...

Page 7: ...l after pressing In this way the modules can be mounted on the heat sink with a good thermal connection Figure 6 Press fitting tools for Easy1B shown left Easy2B shown right Figure 7 Press fitting too...

Page 8: ...face is only exemplary and not fixed for all products within the Easy family The stamp should not touch the TIM material during press in That is why the stamp only touches the substrate areas without...

Page 9: ...aximum PressFIT force per pin PressFIT speed 25 mm min according to IEC 60352 5 qualification 100 mm min recommended PressFIT forces per pin Typ 85 N 100 N max Table 2 PressFIT speed and forces per pi...

Page 10: ...CB and module are not damaged Once the PressFIT zone has been lifted from the PCB the module falls onto the tray in the lower part of the tool and is separated from the board Figure 10 Extrusion of an...

Page 11: ...eft and Easy2B right modules The drawing can be adjusted according to requirements and the tools produced by a manufacturer of choice 4 2 Press out forces To press a module out of a PCB a force of app...

Page 12: ...us contact technologies Siemens norm SN 29500 5 edition 2004 06 Part 5 Process Conductor diameter in mm Failure rate ref in FIT1 Notes Standards guidelines Solder manual Automatic _ 0 5 0 03 IPC 6102...

Page 13: ...the conditions according to the norm The green fields show the test conditions according to the norm which is less critical than in the individual tests Figure 12 Extract from qualification test Furth...

Page 14: ...rt The effective length of the thread in the stand off should have a minimum of 4 mm and a maximum length of 8 mm The initial 1 5 mm of the mounting stand off serves as guidance only and cannot take a...

Page 15: ...isive influence on the heat transfer of the entire system The contact surfaces the surface below the module and the surface of the heat sink have to be free of degradation and contamination to prevent...

Page 16: ...esistance Before the module is mounted onto the heat sink an even layer of thermal grease 80 m thick for Easy1B 2B and 60 m thick for Easy3B is recommended be applied to the module base or to the heat...

Page 17: ...to the PCB or if a later disassembling of the module is desired the PCB must contain suitable through holes The hole size depends on the screwdriver size or the screw s head diameter or washer The mod...

Page 18: ...crew can be applied initially It is important that the module does not lift up To prevent this tighten the first screw loosely to avoid a press force to the clamp Figure 16a Then tighten the second sc...

Page 19: ...sink so that the mounting area of the module is congruent with the threaded holes in the heat sink Make sure that there are no foreign objects between the module and the heat sink The module can be fi...

Page 20: ...g process Table 5 Recommended parameters for heat sink mounting Description Values Mounting screw M5 Recommended mounting torque Mamax 1 5 Nm Recommended property class of bolt 4 6 5 6 Minimal thread...

Page 21: ...y only be subjected to a maximum press and pull force of 6 N vertical to the heat sink The overall pulling force to the module of 20 N must not be exceeded The compressive force could be 10 times high...

Page 22: ...ing must be taken Figure 20 Air path between clip and PCB for Easy1B and Easy2B packages The minimum clearance distance between the screw and the PCB depends on the screw itself For Easy1B and Easy2B...

Page 23: ...6 17 Assembly Instructions for the Easy PressFIT Modules In any case the application specific clearance and creepage distances have to be checked and compared to relevant standards and guaranteed by s...

Page 24: ...ws the press tool with the PCB ready for module assembly In Figure 22d the module is placed on the guiding elements The module is released and the module pins are inserted into the PCB Figure 22e show...

Page 25: ...Application Note 25 Revision 2 4 2019 06 17 Assembly Instructions for the Easy PressFIT Modules...

Page 26: ...or a single module application Figure 23b shows the process where the PCB with the pre assembled modules is placed on the cooling system and the modules are fixed with screws via the spring clamp of...

Page 27: ...The Figure 24 shows a zoom of the final system assembly Depending on the height of the module a small air gap remains between module and PCB As the value H of Figure 23b must not be higher than the mo...

Page 28: ...air gap does not allow the PCB to be screwed down to the stand offs guiding holes as shown in chapter 6 12 3 Press in and mouting only Easy3B modules with PCB and heat sink If only Easy3B modules are...

Page 29: ...B is fixed to the cooler Figure 26c shows the fixing of the PCB to the heatsink As the height tolerance of the module is quasi compensated in the press process the fixing points for the PCB can be clo...

Page 30: ...les Revision History Major changes since the last revision Page or reference Description of change Chapter 3 1 Insertion of illustration about press in tools for Easy3B Chapter 9 2 Insertion of assemb...

Page 31: ...nt of intellectual property rights of any third party with respect to any and all information given in this application note The data contained in this document is exclusively intended for technically...

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