Singlestone
PBA 313 07
Preliminary Product Overview
4/2004
21
4.5 Soldering profile
Generally all standard reflow soldering processes (vapour phase, convection, infra red) and typical
temperature profiles used for surface mount devices are suitable for the Singlestone module. Wave
soldering is not possible.
Figure 4-3 shows an example of a suitable solder reflow profile.
Figure 4-3 : Eutectic Sn/Pb-Solder Profile
Singlestone shall be handled according to MSL3, which means a floor life of 168 h in 30°C/60% r.h.
4.6 Antenna
The antenna output routing should be 50 W (VSWR
≤
2:1) all the way to the antenna in order to
maintain the radio performance listed in this data sheet. For the routing underneath the module, the
modules ground plane should be considered. The type approval for FCC and R&TTE have been done
with an antenna gain of 1.6dBi.
4.7 Shielding / EMC requirements
The module has its own RF shielding and is approved according to the standards by FCC and R&TTE.
If the approval number is not visible on the outside when the module is utilised in the final product, an
exterior label must state that there is a transmitter module inside the product (see Section 5.2).
4.8 Safety
In the R&TTE directives there are safety requirements for high voltage applications. For complying
with the R&TTE security requirements regarding usage in high voltage equipment, using 230V supply,
the device shall be mounted un-resolvable or it needs to be ensured that it cannot cause a short
circuit.
