Singlestone
PBA 313 07
Preliminary Product Overview
4/2004
3
Table of Contents
1
Introduction ...................................................................................................................... 5
2
General Device Overview.............................................................................................. 6
2.1
General Features............................................................................................................. 7
2.2
Block diagram................................................................................................................. 8
2.3
Typical application ......................................................................................................... 8
2.4
Mechanical dimension and pad arrangement ................................................................. 9
2.5
Module pin-out.............................................................................................................. 10
2.6
Functional Block Diagram ............................................................................................ 11
2.7
System Integration and Applications............................................................................ 12
2.7.1
General description.................................................................................................. 12
3
Electrical Specifications ............................................................................................. 13
3.1
Absolute Maximum Ratings.......................................................................................... 13
3.2
Operating conditions .................................................................................................... 13
3.3
Latch-up immunity ........................................................................................................ 13
3.4
Quality .......................................................................................................................... 13
3.5
Capacitance .................................................................................................................. 14
3.6
Current consumption.................................................................................................... 14
3.7
DC Characteristics of Digital Part ................................................................................. 15
3.7.1
Pull Up characteristics on ResetQ ............................................................................. 16
3.8
Operational Range for RF part ...................................................................................... 16
3.9
AC/DC Characteristics of RF part.................................................................................. 16
3.9.1
Transmitter Characteristics....................................................................................... 17
3.9.2
RSSI ....................................................................................................................... 17
3.9.3
Receiver Characteristics........................................................................................... 18
3.10
Characteristics of externally supplied 32.768kHz clock signal............................... 18
4
Assembly and design guidelines ............................................................................. 19
4.1
General description of the module ............................................................................... 19
4.2
Printed Circuit Board design......................................................................................... 19
4.3
Solder paste printing .................................................................................................... 19
4.4
Assembly...................................................................................................................... 20
4.4.1
Component placement ............................................................................................. 20
4.4.2
Pin mark .................................................................................................................. 20
4.5
Soldering profile ........................................................................................................... 21
4.6
Antenna ........................................................................................................................ 21
4.7
Shielding / EMC requirements....................................................................................... 21
4.8
Safety............................................................................................................................ 21
5
Type approvals and Qualification............................................................................. 22
5.1
Bluetooth Qualification ................................................................................................. 22