Singlestone
PBA 313 07
Preliminary Product Overview
4/2004
20
4.4 Assembly
4.4.1 Component placement
In order to assure a high yield soldering process good placement on the PCB is necessary. As a rule
of thumb the tolerable misplacement is 150 µm. This means that the Singlestone module can be
assembled with a variety of placement systems.
The recommendation is to pick and place the module with a nozzle in the centre of the shield. The
nozzle diameter shall not be bigger than 4 mm.
4.4.2 Pin mark
Pin 1 (A0) is marked on bottom footprint and on the top of the shield on the module according to fig
2a-b. Diameter of pin 1 mark on the shield is 0.40 mm.
Figure 2a: Top view
Figure 2b: Bottom view
Figure 4-2 Pin mark
Pin 1 mark mark
Pin 1 mark
0,92
0,92
