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O3R222 O3R225 O3R252
2D/3D camera head
8
4.1 Heat management
ATTENTION
The device can heat up depending on the operating mode, the set parameters and the heat
dissipation to the environment.
The difference between the device’s surface temperature and the ambient temperature
must not exceed 25 degrees (according to IEC61010-2-201).
u
Reduce the surface temperature.
u
Adjust the operating mode and the parameters.
The device develops a thermal power loss of up to 8 W, depending on the exposure time and frame
rate set (
Ò
Technical data).
u
Design a mounting fixture that can dissipate the thermal power loss.
w
The mounting fixture must meet the following properties:
- thermal connection with a thermal resistance < 2.5 K/W,
- cooling surface of > 10x10 cm,
- good heat-conducting material, for example aluminium.
u
Ensure sufficient
on the device and mounting fixtures.
w
Obstructions around the device and a high installation density may have a negative impact on
convection.
u
Reduce the exposure time or frame rate.
w
The surface temperature decreases if the parameters are reduced.