IBM xSeries 366, Problem Determination And Service Manual

Page: 153 / 184

Heat sink
Microprocessor
Microprocessor
baffle
VRM 4
FR
ONT
Air baffle
FR
ONT
FR
ONT
FR
ONT
1. Read the safety information that begins on page vii, and “Handling
static-sensitive devices” on page 112.
2. Turn off the server and peripheral devices, and disconnect the power cords
and all external cables necessary to replace the device.
3. Remove the top cover and bezel (see “Removing the cover and bezel” on
page 113).
4. Remove all fans (see “Hot-swap fan” on page 116).
5. Remove the memory cards (see “Removing and replacing a memory card” on
page 123).
6. Lift the microprocessor-tray release latch.
7. Open the microprocessor-tray levers.
Attention: The microprocessor tray is heavy. Pull the tray partially out of the
server, and then reposition your hands to grasp the body of the tray, before
pulling out the tray the rest of the way.
8. Remove the microprocessor tray.
9. Press in on the release latches on each side of the tray; then, pull the tray out
the rest of the way.
10. Lift the air baffle out of the microprocessor tray.
11. Open the heat sink-release lever and remove the heat sink.
12. Open the microprocessor-release lever and remove the microprocessor from
the microprocessor socket.
Chapter 4. Removing and replacing server components
137