Combining high-performance architecture with high-performance Xeon processors
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14
x3850 M2 / x3950 M2 Specifications
Machine type
x3850 M2
7141-1RX/1RY, 2RX/2RY, 3HX/3HY,
3RX/3RY, 4RX/4RY
—3 yr. warranty;
7233-2RX/2RY, 5RX/5RY, 6RX/6RY,
7RX/7RY
—3 yr. warranty;
7234-6RX/6RY
—4 yr. warranty
x3950 M2
7144-1SX/1SY, 3SX/3SY, 4SX/4SY
—3
yr. warranty;
7233-2SX/2SY, 5SX/5xSY, 6SX/6SY,
7SX/7SY
—3 yr. warranty;
7234-6SX/6SY
—4 yr. warranty
Form factor (standard/maximum)
4U / 16U
Processor type
Six-core
Xeon
(E74xx/L74xx/X74xx)
2.13GHz
E7420
(2xX/2xY),
2.13GHz
L7445 (7xX/7xY),
2.4GHz
E7450 (5xX/5xY),
2.66GHz
X7460 (6xX/6xY)
Quad-core
Xeon
(E73xx/X73xx)
1.6GHz
E7310 (1SX/1SY),
2.13GHz
E7320
(2xX/2xY),
2.4GHz
E7330
(3xX/3xY),
2.93GHz
X7350 (4xX/4xY)
Dual-core
Xeon
(72xx)
2.4GHz
E7210 (1RX/1RY)
Maximum processor power draw
130W
(
7141/7144
-
4xX/4xY;
7233
-
6xX/6xY)
90W
(
7233
-
2xX/2xY, 5xX/5xY)
80W
(
7141/7144
-
1xX/1xY, 2xX/2xY,
3xX/3xY)
50W
(7xX/7xY)
Front-side bus (FSB) speed
1066MHz x 4 FSBs
# of independent front-side buses
4
# of processors standard / maximum
2 / 4 (per chassis)
Internal L2 cache
9MB
(3 x 3MB)—
7233/7234
(all)
8MB
(2 x 4MB)—
7141/7144-
1xX/1xY, 4xX/4xY
6MB
(2 x 3MB)—
7141/7144-
3xX/3xY
4MB
(2 x 2MB)—
7141/7144-
2xX/2xY
External L3 cache
16MB
shared cache—
7233-
6xX/6xY
12MB
shared cache—
7233-
5xX/5xY, 7xX/7xY
8MB
shared cache—
7233-
2xX/2xY
XceL4v Dynamic Server (L4) cache
Up to
256MB
per chassis (
1TB
max.)
Chipset
IBM eX4
ScaleXpander Option Kit
Standard
(
7144
-1SX/1SY, 3SX/3SY,
4SX/4SY)
Optional
(
7141
-1RX/1RY, 2RX/2RY,
3HX/3HY, 3RX/3RY, 4RX/4RY;
7233
-
2RX/2RY, 5RX/5RY, 6RX/6RY,
7RX/7RY)
Scalability ports
3 (per chassis)
# of interconnected nodes (chassis)
maximum
4
Standard / maximum memory
6
(per
chassis)
8GB
(4 x 2GB on 2
memory cards) /
256GB
(3HX/3HY)
8GB
(8 x 1GB on 4
memory cards) /
256GB
(3RX/3RY, 3SX/3SY,
4xX/4xY, 5RX/5RY,
5SX/5SY, 6xX/6xY)
4GB
(4 x 1GB on 2
memory cards) /
256GB
(1xX/1xY, 2xX/2xY,
7xX/7xY)
Standard memory type
Registered
PC2-5300 (
533MHz
) DDR II ECC with
Chipkill
protection
Memory interleaving
Yes (two-way using pairs of DIMMs)
DIMM capacities supported
1GB, 2GB, 4GB, 8GB
# of DIMM sockets total / available
32 / 24
(3RX/3RY, 3SX/3SY, 4xX/4xY,
5RX/5RY, 5SX/5SY, 6xX/6xY)
32 / 28
(3HX/3HY, 4xX/4xY, 7xX/7xY)
Memory mirroring supported
Yes
6
Maximum memory and disk capacity may require the replacement of standard components with the largest supported component
available.