IBM S822LC, Technical Overview And Introduction

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IBM Power Systems S822LC for High Performance Computing
򐂰 The vertical distance between the mounting holes must consist of sets of three holes
spaced (from bottom to top) 15.9 mm (0.625 in.), 15.9 mm (0.625 in.), and 12.67 mm (0.5
in.) on-center, which makes each three-hole set of vertical hole spacing 44.45 mm
(1.75 in.) apart on center. Rail-mounting holes must be 7.1 mm ± 0.1 mm (0.28 in. ±
0.004 in.) in diameter. Figure A-4 shows the top front specification dimensions.
Figure A-4 Rack specification dimensions top front view
Energy management
The Power S822LC servers have features to help clients become more energy efficient.
EnergyScale technology enables advanced energy management features to conserve power
dramatically and dynamically and further improve energy efficiency. Intelligent Energy
optimization capabilities enable the POWER8 processor to operate at a higher frequency for
increased performance and performance per watt, or to reduce dramatically the frequency to
save energy.
Hole Diameter =
7.1 +/- 0.1mm
Rack Mounting Holes Center-to-Center
Rack Front Opening
450 +/- 0.75mm
465 +/- 0.8mm
EIA Hole Spacing
6.75mm min
15.9mm
15.9mm
12.7mm
15.9mm
15.9mm
12.7mm
6.75mm min
15.9mm
15.9mm
12.7mm
15.9mm
15.9mm
12.7mm
Top Front of Rack
Top Front of Rack