EM78P312N
8-Bit Microcontroller
64
•
Product Specification (V1.0) 10.03.2006
(This specification is subject to change without further notice)
APPENDIX
A Package
Types:
OTP MCU
Package Type
Pin Count
Package Size
EM78P312NP DIP
28
600
mil
EM78P312NK SDIP
28
400
mil
EM78P312NAK SDIP
28
300
mil
EM78P312NM SOP
28
300
mil
EM78P312NS SSOP
28
209
mil
Y/S/J
:
Green product does not contain hazardous substances.
The third edition of Sony SS-00259 standard.
Pb content should be less than 100ppm.
Pb content to fit in with Sony spec.
Part No.
EM78P311SxY
EM78P311SxS/xJ
Electroplate type
Sn/Cu
Pure Tin
Ingredient (%)
Cu:1.0~3.0%
Sn :100%
Melting point(°C)
~227°C
232°C
Electrical resistivity
(
μ
Ω
-cm)
13 11.4
Hardness (hv)
10~12
8~10
Elongation (%)
40%
>50%