4–42
Maintenance and Service Guide
Removal and replacement procedures
✎
The thermal material must be thoroughly cleaned from the surfaces of the heat sink and the system board
each time the heat sink is removed:
❏
Thermal paste is used on the processor
1
and the heat sink section
2
that services it.
❏
Thermal pads are used on the Northbridge chip
3
and the heat sink section
4
that services it.
❏
Thermal pads are used on the Southbridge chip
5
and the heat sink section
6
that services it.
Replacement thermal material is included with all system board and heat sink spare part kits.
Reverse this procedure to install the heat sink.
Summary of Contents for ProBook 6445b - Notebook PC
Page 16: ...1 8 Maintenance and Service Guide Product description ...
Page 36: ...3 2 Maintenance and Service Guide Illustrated parts catalog Computer major components ...
Page 53: ...Illustrated parts catalog Maintenance and Service Guide 3 19 Display assembly subcomponents ...
Page 74: ...3 40 Maintenance and Service Guide Illustrated parts catalog ...
Page 156: ...4 82 Maintenance and Service Guide Removal and replacement procedures ...