4–52
Maintenance and Service Guide
Removal and replacement procedures
✎
The thermal material must be thoroughly cleaned from the surfaces of the fan/heat sink assembly and the system
board each time the fan/heat sink assembly is removed:
■
Thermal paste is used on the processor
1
and the heat sink section
2
that services it.
■
Thermal pads are used on the Northbridge chip
3
and the heat sink section
4
that services it.
■
Thermal pads are used on the graphics subsystem memory module
5
and the heat sink section
6
that
services it.
■
Thermal pads are used on the other system board components
7
and heat sink sections
8
that service them.
Replacement thermal material is included with all system board, fan/heat sink assembly, and processor spare
part kits.
