Design-In - Mechanical Aspects
15/78
COMX Communication Modules | Design Guide
DOC100901DG18EN | Revision 18 | English | 2013-12 | Released | Public
© Hilscher, 2002-2013
2.2 Mechanical Dimensions
2.2.1
Common Mechanical Dimensions for COMX Modules
After mounting the COMX-CA Module parallel at a basis board the rotary switches, LEDs and the
fieldbus connector are on the top side and are angled to the basis board. The edge of all front ele-
ments are in one layer which is 2.5 mm ahead of the edge of printed circuit board of the COMX
Module.
The COMX-CN Module has to be used if the mechanical dimensions or order of the LEDs,
switches and fieldbus connector does not fit. In that case you have to place these components di-
rectly on the motherboard and feed the signals to the connector X2 of the COMX-CN Module.
Note
Please take care on the isolation distance, because the optical isolation interface is on
the module!
Especially for 12 MBit PROFIBUS the distance should be as small as possible.
For Ethernet the signal traces should run parallel and should have the same length.
Please refer at the fieldbus standards for further information!
2.2.2
Mechanical Dimensions of COMX Modules
The COMX Module has a board size of 30 x 70 mm.
The maximum height of the components at the top side of the printed circuit board is 14.0 mm in-
cluding the fieldbus connector which is also the component defining the height of the CA type. For
the CN type, the parts defining the height of these modules are the DC/DC converter and the trans-
former.
In order to assure the long-term availability of the modules, Hilscher claims the right to perform a
redesign if necessary due to changes in availability of components and to exchange these compo-
nents by similar ones which might differ in their dimensions.
In detail, the current minimum space requirements are given by the following table right below.
COMX Module
Minimum required space on top of top side of the printed circuit board
CA type
14 mm
CN type
9 mm
Table 7: Minimum Required Space on top of Top Side of the Printed Circuit Board
However, in order
to be able to exchange a COMX module against any other type of COMX module later
and to be sure that future COMX modules which might have been affected by a redesign will
fit under any circumstances
and to avoid thermal problems,
we urgently recommend to obey the following rule:
Note:
Keep the space of 14.0 mm above the top side of the COMX modules free.
At the bottom side the maximum height is 4.0 mm, therefore you have 2.5 mm space for compo-
nents on the host board below the module. The power dissipation in that area should be less than
330 mW!
