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KXX-A12040 A
Take precautions to protect the window from contamination or scratches when packing or shipping
equipment in which the product is installed.
(2) Precautions when mounting
The product is a precision optical component, so placing excessive loads on the package may cause
problems such as package warping or damage, chip peeling, wire breakage, damage to thermoelectric
cooler, or poor optical characteristics. Take full precautions when mounting the product on the board,
inserting the product into the socket, or installing the heatsink.
Never handle the product in the following ways since this may cause the package to break.
・
apply repeated stress to the leads.
・
suddenly cool or suddenly heat the product.
Check the pin connection positions when mounting the product in the socket. Installing the product
reversely or in the wrong position may damage the product. Be sure to turn on the power after the product
has been properly installed.
Be aware that inserting the product reversely, inserting it incorrectly, or causing short-circuit between
terminals may lead to malfunctions.
If external force is repeatedly applied to the leads, this may damage the leads. When installing this product
in locations subject to vibration, secure it with resin or a holder, etc.
(3) Precautions for designing the circuit board
The packaging of the micro-spectrometer is electrically conductive, so be careful when designing the circuit
to avoid short circuit caused by contact with a circuit pattern.
Soldering
(1) Precautions during soldering
Take sufficient care to make sure that the soldering iron tip temperature and soldering time are correct. Do
not attempt soldering at high temperatures or for long periods. Soldering at high temperatures or for long
periods may cause the package to crack or the window material to separate from the package.
It is recommended that the MS series be soldered within 3 seconds at 370 °C or less and the
micro-spectrometers within 3.5 seconds at 350 °C or less when soldering by hand, and both be soldered
within 10 seconds at 260 °C or less when using reflow soldering.
Take measures to prevent solder or flux from flying outward and sticking to the
light input window,
contaminating it.
(2) Flux
Use non-cleaning solder or rosin type flux. Using flux with relatively strong acid or alkali levels or inorganic
flux may cause corrosion on the leads.
(3) When using a soldering iron
Set the soldering iron tip temperature by referring to the recommended soldering condition. If you cannot
provide these conditions, then grip the root of the lead you are soldering with tweezers or a similar tool to
prevent heat from conducting to the product package.
