GSWP050W-EVBPA
GaN E-HEMT Wireless Power Transfer Evaluation Board
User’s Guide
_____________________________________________________________________________________________________________________
GSWP050W-EVBPA Rev 190304
© 2019 GaN Systems Inc.
www.gansystems.com 12
Please refer to the Evaluation Board/Kit Important Notice on page 22
copper coin.
Figure 13 •
Copper coins soldered beneath PCB and devices top PCB
Figure 14 •
Aluminum heatsink plate with housing for the copper coins
Heatplate
PCB back side
Housing of copper
coin
Copper coin
