GSWP050W-EVBPA
GaN E-HEMT Wireless Power Transfer Evaluation Board
User’s Guide
_____________________________________________________________________________________________________________________
GSWP050W-EVBPA Rev 190304
© 2019 GaN Systems Inc.
www.gansystems.com 16
Please refer to the Evaluation Board/Kit Important Notice on page 22
Figure 16 •
Proper oscilloscope probe measurement technique
PA Performance
Power-on Procedure
•
An additional heatsink may be required. The PA heatplate is provided with threaded hole
locations that can be used to attach the heatsink to the heatplate with 4-40 screws. To ensure
excellent thermal conduction, apply thermal grease to the PA / heatsink interface before
screwing the units together. Enough thermal grease should be applied so that a small amount
extrudes on all four sides as the screws are tightened. Wipe the assembly clean.
•
Solder the wires with the SMA connector to JP57.
•
Connector the load to JP57
•
Plug the 5V
DC
supply into JP35. Pin 1: positive. Pin 2: negative. Turn the supply on and set the
DC input voltage to 5V
•
Plug the HV supply into J32. Pin 1: positive. Pin 2: negative. Turn the supply on and ramp the
voltage from 0V to 10V.
•
Monitor the test point voltage by comparing the power meter measurement to GaN Systems’
test data which is available in Appendix A.
•
If the measurements correlate, increase the HV supply to 20V
DC.
•
IMPORTANT: Ensure the 5V
DC
supply does not exceed 6V during testing.
Evaluation Results