H8743FP
3-3-3
H8743EL
C414
CERAMIC CAP.(AX) B K 820pF/50V or
CCA1JKT0B821
CERAMIC CAP.(AX) B J 820pF/50V
CCA1JJT0B821
C415
ELECTROLYTIC CAP. 4.7
µ
F/25V M H7
CE1EMASSL4R7
C416
CHIP CERAMIC CAP. F Z 0.1
µ
F/50V or
CHD1JZB0F104
CHIP CERAMIC CAP. F Z 0.1
µ
F/25V or
CHD1EZB0F104
CHIP CERAMIC CAP. F Z 0.1
µ
F/50V or
CHD1JZ30F104
CHIP CERAMIC CAP. F Z 0.1
µ
F/25V CHD1EZ30F104
C417
CHIP CERAMIC CAP. CH J 220pF/50V or
CHD1JJBCH221
CHIP CERAMIC CAP. CH J 220pF/50V
CHD1JJ3CH221
C418
CHIP CERAMIC CAP. CH J 33pF/50V or
CHD1JJBCH330
CHIP CERAMIC CAP. CH J 33pF/50V
CHD1JJ3CH330
C420
ELECTROLYTIC CAP. 22
µ
F/10V M H7
CE1AMASSL220
C421
ELECTROLYTIC CAP. 33
µ
F/6.3V M H7
CE0KMASSL330
C423
CHIP CERAMIC CAP. B K 0.01
µ
F/50V or
CHD1JKB0B103
CHIP CERAMIC CAP. B K 0.01
µ
F/50V CHD1JK30B103
C424
ELECTROLYTIC CAP. 47
µ
F/6.3V M H7
CE0KMASSL470
C502
ELECTROLYTIC CAP. 1
µ
F/50V M H7
CE1JMASSL010
C503
CHIP CERAMIC CAP. B K 0.022
µ
F/50V or
CHD1JKB0B223
CHIP CERAMIC CAP. B K 0.022
µ
F/25V or
CHD1EKB0B223
CHIP CERAMIC CAP. B K 0.022
µ
F/50V or
CHD1JK30B223
CHIP CERAMIC CAP. B K 0.022
µ
F/25V CHD1EK30B223
C504
ELECTROLYTIC CAP. 100
µ
F/6.3V M H7
CE0KMASSL101
C505
CHIP CERAMIC CAP. CH D 10pF/50V or
CHD1JDBCH100
CHIP CERAMIC CAP. CH D 10pF/50V
CHD1JD3CH100
C506
CHIP CERAMIC CAP. CH D 10pF/50V or
CHD1JDBCH100
CHIP CERAMIC CAP. CH D 10pF/50V
CHD1JD3CH100
C507
CHIP CERAMIC CAP. CH J 22pF/50V or
CHD1JJBCH220
CHIP CERAMIC CAP. CH J 22pF/50V
CHD1JJ3CH220
C508
CHIP CERAMIC CAP. CH J 22pF/50V or
CHD1JJBCH220
CHIP CERAMIC CAP. CH J 22pF/50V
CHD1JJ3CH220
C509
ELECTROLYTIC CAP. 22
µ
F/10V M H7
CE1AMASSL220
C514
CHIP CERAMIC CAP. B K 0.022
µ
F/50V or
CHD1JKB0B223
CHIP CERAMIC CAP. B K 0.022
µ
F/25V or
CHD1EKB0B223
CHIP CERAMIC CAP. B K 0.022
µ
F/50V or
CHD1JK30B223
CHIP CERAMIC CAP. B K 0.022
µ
F/25V CHD1EK30B223
C515
CHIP CERAMIC CAP. B K 0.022
µ
F/50V or
CHD1JKB0B223
CHIP CERAMIC CAP. B K 0.022
µ
F/25V or
CHD1EKB0B223
CHIP CERAMIC CAP. B K 0.022
µ
F/50V or
CHD1JK30B223
CHIP CERAMIC CAP. B K 0.022
µ
F/25V CHD1EK30B223
C516
CHIP CERAMIC CAP. CH J 100pF/50V or
CHD1JJBCH101
CHIP CERAMIC CAP. CH J 100pF/50V
CHD1JJ3CH101
C518
CHIP CERAMIC CAP. B K 2200pF/50V or
CHD1JKB0B222
CHIP CERAMIC CAP. B K 2200pF/50V
CHD1JK30B222
C519
CHIP CERAMIC CAP. B K 0.022
µ
F/50V or
CHD1JKB0B223
CHIP CERAMIC CAP. B K 0.022
µ
F/25V or
CHD1EKB0B223
CHIP CERAMIC CAP. B K 0.022
µ
F/50V or
CHD1JK30B223
CHIP CERAMIC CAP. B K 0.022
µ
F/25V CHD1EK30B223
C520
CHIP CERAMIC CAP. B K 0.022
µ
F/50V or
CHD1JKB0B223
CHIP CERAMIC CAP. B K 0.022
µ
F/25V or
CHD1EKB0B223
CHIP CERAMIC CAP. B K 0.022
µ
F/50V or
CHD1JK30B223
CHIP CERAMIC CAP. B K 0.022
µ
F/25V CHD1EK30B223
C521
CHIP CERAMIC CAP. B K 0.022
µ
F/50V or
CHD1JKB0B223
CHIP CERAMIC CAP. B K 0.022
µ
F/25V or
CHD1EKB0B223
CHIP CERAMIC CAP. B K 0.022
µ
F/50V or
CHD1JK30B223
CHIP CERAMIC CAP. B K 0.022
µ
F/25V CHD1EK30B223
C522
ELECTROLYTIC CAP. 220
µ
F/6.3V M or
CE0KMASDL221
ELECTROLYTIC CAP. 220
µ
F/6.3V M
CE0KMASTL221
C523
ELECTROLYTIC CAP. 47
µ
F/6.3V M or
CE0KMASDL470
ELECTROLYTIC CAP. 47
µ
F/6.3V M
CE0KMASTL470
C526
CHIP CERAMIC CAP. B K 0.022
µ
F/50V or
CHD1JKB0B223
CHIP CERAMIC CAP. B K 0.022
µ
F/25V or
CHD1EKB0B223
Ref. No.
Description
Part No.
CHIP CERAMIC CAP. B K 0.022
µ
F/50V or
CHD1JK30B223
CHIP CERAMIC CAP. B K 0.022
µ
F/25V CHD1EK30B223
C529
CHIP CERAMIC CAP. B K 0.01
µ
F/50V or
CHD1JKB0B103
CHIP CERAMIC CAP. B K 0.01
µ
F/50V CHD1JK30B103
C530
CHIP CERAMIC CAP. B K 0.01
µ
F/50V or
CHD1JKB0B103
CHIP CERAMIC CAP. B K 0.01
µ
F/50V CHD1JK30B103
C531
CHIP CERAMIC CAP. B K 0.01
µ
F/50V or
CHD1JKB0B103
CHIP CERAMIC CAP. B K 0.01
µ
F/50V CHD1JK30B103
C551
CHIP CERAMIC CAP. CH J 100pF/50V or
CHD1JJBCH101
CHIP CERAMIC CAP. CH J 100pF/50V
CHD1JJ3CH101
C552
ELECTROLYTIC CAP. 47
µ
F/6.3V M H7
CE0KMASSL470
C553
ELECTROLYTIC CAP. 10
µ
F/16V M H7
CE1CMASSL100
C554
CHIP CERAMIC CAP. B K 0.01
µ
F/50V or
CHD1JKB0B103
CHIP CERAMIC CAP. B K 0.01
µ
F/50V CHD1JK30B103
C555
CHIP CERAMIC CAP. CH J 220pF/50V or
CHD1JJBCH221
CHIP CERAMIC CAP. CH J 220pF/50V
CHD1JJ3CH221
C557
CHIP CERAMIC CAP. CH J 330pF/50V or
CHD1JJBCH331
CHIP CERAMIC CAP. CH J 330pF/50V
CHD1JJ3CH331
C558
CHIP CERAMIC CAP. B K 0.022
µ
F/50V or
CHD1JKB0B223
CHIP CERAMIC CAP. B K 0.022
µ
F/25V or
CHD1EKB0B223
CHIP CERAMIC CAP. B K 0.022
µ
F/50V or
CHD1JK30B223
CHIP CERAMIC CAP. B K 0.022
µ
F/25V CHD1EK30B223
C559
CHIP CERAMIC CAP. B K 0.047
µ
F/50V or
CHD1JKB0B473
CHIP CERAMIC CAP. B K 0.047
µ
F/25V or
CHD1EKB0B473
CHIP CERAMIC CAP. B K 0.047
µ
F/50V or
CHD1JK30B473
CHIP CERAMIC CAP. B K 0.047
µ
F/25V CHD1EK30B473
C561
CHIP CERAMIC CAP. B K 1000pF/50V or
CHD1JKB0B102
CHIP CERAMIC CAP. B K 1000pF/50V
CHD1JK30B102
C562
CHIP CERAMIC CAP. B K 2200pF/50V or
CHD1JKB0B222
CHIP CERAMIC CAP. B K 2200pF/50V
CHD1JK30B222
C581
ELECTROLYTIC CAP. 47
µ
F/16V M H7
CE1CMASSL470
C583
CHIP CERAMIC CAP. F Z 0.1
µ
F/50V or
CHD1JZB0F104
CHIP CERAMIC CAP. F Z 0.1
µ
F/25V or
CHD1EZB0F104
CHIP CERAMIC CAP. F Z 0.1
µ
F/50V or
CHD1JZ30F104
CHIP CERAMIC CAP. F Z 0.1
µ
F/25V CHD1EZ30F104
C584
ELECTROLYTIC CAP. 47
µ
F/16V M H7
CE1CMASSL470
C585
CHIP CERAMIC CAP. B K 0.01
µ
F/50V or
CHD1JKB0B103
CHIP CERAMIC CAP. B K 0.01
µ
F/50V CHD1JK30B103
C586
CHIP CERAMIC CAP. B K 0.01
µ
F/50V or
CHD1JKB0B103
CHIP CERAMIC CAP. B K 0.01
µ
F/50V CHD1JK30B103
C587
CHIP CERAMIC CAP. F Z 0.1
µ
F/50V or
CHD1JZB0F104
CHIP CERAMIC CAP. F Z 0.1
µ
F/25V or
CHD1EZB0F104
CHIP CERAMIC CAP. F Z 0.1
µ
F/50V or
CHD1JZ30F104
CHIP CERAMIC CAP. F Z 0.1
µ
F/25V CHD1EZ30F104
C588
CHIP CERAMIC CAP. F Z 0.1
µ
F/50V or
CHD1JZB0F104
CHIP CERAMIC CAP. F Z 0.1
µ
F/25V or
CHD1EZB0F104
CHIP CERAMIC CAP. F Z 0.1
µ
F/50V or
CHD1JZ30F104
CHIP CERAMIC CAP. F Z 0.1
µ
F/25V CHD1EZ30F104
C589
ELECTROLYTIC CAP. 10
µ
F/16V M H7
CE1CMASSL100
C590
CHIP CERAMIC CAP. F Z 0.1
µ
F/50V or
CHD1JZB0F104
CHIP CERAMIC CAP. F Z 0.1
µ
F/25V or
CHD1EZB0F104
CHIP CERAMIC CAP. F Z 0.1
µ
F/50V or
CHD1JZ30F104
CHIP CERAMIC CAP. F Z 0.1
µ
F/25V CHD1EZ30F104
C591
CHIP CERAMIC CAP. B K 1000pF/50V or
CHD1JKB0B102
CHIP CERAMIC CAP. B K 1000pF/50V
CHD1JK30B102
C594
ELECTROLYTIC CAP. 10
µ
F/16V M H7
CE1CMASSL100
C602
CHIP CERAMIC CAP. B K 0.047
µ
F/50V or
CHD1JKB0B473
CHIP CERAMIC CAP. B K 0.047
µ
F/25V or
CHD1EKB0B473
CHIP CERAMIC CAP. B K 0.047
µ
F/50V or
CHD1JK30B473
CHIP CERAMIC CAP. B K 0.047
µ
F/25V CHD1EK30B473
C702
CERAMIC CAP.(AX) F Z 0.047
µ
F/16V CCA1CZTFZ473
Ref. No.
Description
Part No.
Summary of Contents for 23C-250
Page 22: ...1 8 3 1 8 4 1 8 5 H8624SCM1 Main 1 4 Schematic Diagram...
Page 23: ...1 8 6 1 8 7 1 8 8 H8624SCM2 Main 2 4 Schematic Diagram...
Page 24: ...1 8 9 1 8 10 1 8 11 H8624SCM3 Main 3 4 Schematic Diagram...
Page 25: ...1 8 12 1 8 13 1 8 14 H8624SCM4 Main 4 4 Schematic Diagram Function Schematic Diagram H8743SCF...
Page 26: ...1 8 15 1 8 16 Jack Schematic Diagram H8622SCJ...
Page 27: ...1 8 17 1 8 18 SECAM Schematic Diagram H8624SCS...
Page 30: ...1 8 26 1 8 25 BH8700F01031 Function CBA Top View Function CBA Bottom View...
Page 31: ...1 8 28 1 8 27 BH8700F01021 Jack CBA Top View Jack CBA Bottom View...
Page 32: ...1 8 30 1 8 29 SECAM CBA Top View SECAM CBA Bottom View BH8700F01011 C...
Page 58: ...EXPLODED VIEWS Front Panel A1X 3 1 1 H8743FEX...
Page 60: ...Packing Some Ref Numbers are not in sequence S2 S2 X4 S1 X1 X2 X20 X3 Unit S3 3 1 3 H8740PEX...
Page 78: ...23C 250 23C 250A H8743FP Printed in Japan 2001 04 20 HO...