H8743FP
3-3-2
H8743EL
C326
CHIP CERAMIC CAP. B K 0.047
µ
F/50V or
CHD1JKB0B473
CHIP CERAMIC CAP. B K 0.047
µ
F/25V or
CHD1EKB0B473
CHIP CERAMIC CAP. B K 0.047
µ
F/50V or
CHD1JK30B473
CHIP CERAMIC CAP. B K 0.047
µ
F/25V CHD1EK30B473
C327
CHIP CERAMIC CAP. B K 0.01
µ
F/50V or
CHD1JKB0B103
CHIP CERAMIC CAP. B K 0.01
µ
F/50V CHD1JK30B103
C328
ELECTROLYTIC CAP. 47
µ
F/6.3V M H7
CE0KMASSL470
C330
CHIP CERAMIC CAP. B K 0.01
µ
F/50V or
CHD1JKB0B103
CHIP CERAMIC CAP. B K 0.01
µ
F/50V CHD1JK30B103
C331
ELECTROLYTIC CAP. 1
µ
F/50V M H7
CE1JMASSL010
C332
ELECTROLYTIC CAP. 10
µ
F/16V M H7
CE1CMASSL100
C333
ELECTROLYTIC CAP. 1
µ
F/50V M H7
CE1JMASSL010
C334
CHIP CERAMIC CAP. B K 0.01
µ
F/50V or
CHD1JKB0B103
CHIP CERAMIC CAP. B K 0.01
µ
F/50V CHD1JK30B103
C335
CHIP CERAMIC CAP. B K 0.01
µ
F/50V or
CHD1JKB0B103
CHIP CERAMIC CAP. B K 0.01
µ
F/50V CHD1JK30B103
C336
CHIP CERAMIC CAP. CH J 470pF/50V or
CHD1JJBCH471
CHIP CERAMIC CAP. CH J 470pF/50V
CHD1JJ3CH471
C337
CHIP CERAMIC CAP. B K 0.01
µ
F/50V or
CHD1JKB0B103
CHIP CERAMIC CAP. B K 0.01
µ
F/50V CHD1JK30B103
C338
ELECTROLYTIC CAP. 47
µ
F/6.3V M H7
CE0KMASSL470
C339
CHIP CERAMIC CAP. B K 0.01
µ
F/50V or
CHD1JKB0B103
CHIP CERAMIC CAP. B K 0.01
µ
F/50V CHD1JK30B103
C340
CHIP CERAMIC CAP. B K 0.01
µ
F/50V or
CHD1JKB0B103
CHIP CERAMIC CAP. B K 0.01
µ
F/50V CHD1JK30B103
C341
CHIP CERAMIC CAP. B K 0.01
µ
F/50V or
CHD1JKB0B103
CHIP CERAMIC CAP. B K 0.01
µ
F/50V CHD1JK30B103
C342
CHIP CERAMIC CAP. F Z 0.1
µ
F/50V or
CHD1JZB0F104
CHIP CERAMIC CAP. F Z 0.1
µ
F/25V or
CHD1EZB0F104
CHIP CERAMIC CAP. F Z 0.1
µ
F/50V or
CHD1JZ30F104
CHIP CERAMIC CAP. F Z 0.1
µ
F/25V CHD1EZ30F104
C344
ELECTROLYTIC CAP. 1
µ
F/50V M H7
CE1JMASSL010
C345
ELECTROLYTIC CAP. 1
µ
F/50V M H7
CE1JMASSL010
C346
CHIP CERAMIC CAP. B K 0.022
µ
F/50V or
CHD1JKB0B223
CHIP CERAMIC CAP. B K 0.022
µ
F/25V or
CHD1EKB0B223
CHIP CERAMIC CAP. B K 0.022
µ
F/50V or
CHD1JK30B223
CHIP CERAMIC CAP. B K 0.022
µ
F/25V CHD1EK30B223
C348
ELECTROLYTIC CAP. 1
µ
F/50V M H7
CE1JMASSL010
C349
CHIP CERAMIC CAP. B K 0.022
µ
F/50V or
CHD1JKB0B223
CHIP CERAMIC CAP. B K 0.022
µ
F/25V or
CHD1EKB0B223
CHIP CERAMIC CAP. B K 0.022
µ
F/50V or
CHD1JK30B223
CHIP CERAMIC CAP. B K 0.022
µ
F/25V CHD1EK30B223
C351
CHIP CERAMIC CAP. B K 0.047
µ
F/50V or
CHD1JKB0B473
CHIP CERAMIC CAP. B K 0.047
µ
F/25V or
CHD1EKB0B473
CHIP CERAMIC CAP. B K 0.047
µ
F/50V or
CHD1JK30B473
CHIP CERAMIC CAP. B K 0.047
µ
F/25V CHD1EK30B473
C352
CHIP CERAMIC CAP. B K 0.022
µ
F/50V or
CHD1JKB0B223
CHIP CERAMIC CAP. B K 0.022
µ
F/25V or
CHD1EKB0B223
CHIP CERAMIC CAP. B K 0.022
µ
F/50V or
CHD1JK30B223
CHIP CERAMIC CAP. B K 0.022
µ
F/25V CHD1EK30B223
C355
ELECTROLYTIC CAP. 100
µ
F/16V M or
CE1CMASDL101
ELECTROLYTIC CAP. 100
µ
F/16V M
CE1CMASTL101
C358
CHIP CERAMIC CAP. CH J 470pF/50V or
CHD1JJBCH471
CHIP CERAMIC CAP. CH J 470pF/50V
CHD1JJ3CH471
C360
CHIP CERAMIC CAP. CH J 68pF/50V or
CHD1JJBCH680
CHIP CERAMIC CAP. CH J 68pF/50V
CHD1JJ3CH680
C370
CHIP CERAMIC CAP. B K 0.01
µ
F/50V or
CHD1JKB0B103
CHIP CERAMIC CAP. B K 0.01
µ
F/50V CHD1JK30B103
C371
CHIP CERAMIC CAP. F Z 0.1
µ
F/50V or
CHD1JZB0F104
CHIP CERAMIC CAP. F Z 0.1
µ
F/25V or
CHD1EZB0F104
CHIP CERAMIC CAP. F Z 0.1
µ
F/50V or
CHD1JZ30F104
Ref. No.
Description
Part No.
CHIP CERAMIC CAP. F Z 0.1
µ
F/25V CHD1EZ30F104
C372
CHIP CERAMIC CAP. CH J 680pF/50V or
CHD1JJBCH681
CHIP CERAMIC CAP. CH J 680pF/25V or
CHD1EJBCH681
CHIP CERAMIC CAP. CH J 680pF/50V or
CHD1JJ3CH681
CHIP CERAMIC CAP. CH J 680pF/25V
CHD1EJ3CH681
C374
ELECTROLYTIC CAP. 1
µ
F/50V M H7
CE1JMASSL010
C375
CHIP CERAMIC CAP. B K 0.01
µ
F/50V or
CHD1JKB0B103
CHIP CERAMIC CAP. B K 0.01
µ
F/50V CHD1JK30B103
C376
CERAMIC CAP.(AX) B J 180pF/50V
CCA1JJT0B181
C377
ELECTROLYTIC CAP. 0.47
µ
F/50V M H7
CE1JMASSLR47
C379
CHIP CERAMIC CAP. B K 0.01
µ
F/50V or
CHD1JKB0B103
CHIP CERAMIC CAP. B K 0.01
µ
F/50V CHD1JK30B103
C380
ELECTROLYTIC CAP. 10
µ
F/16V M H7
CE1CMASSL100
C381
CHIP CERAMIC CAP. B K 1000pF/50V or
CHD1JKB0B102
CHIP CERAMIC CAP. B K 1000pF/50V
CHD1JK30B102
C382
ELECTROLYTIC CAP. 0.47
µ
F/50V M H7
CE1JMASSLR47
C383
CHIP CERAMIC CAP. CH J 150pF/50V or
CHD1JJBCH151
CHIP CERAMIC CAP. CH J 150pF/50V
CHD1JJ3CH151
C384
CHIP CERAMIC CAP. B K 0.01
µ
F/50V or
CHD1JKB0B103
CHIP CERAMIC CAP. B K 0.01
µ
F/50V CHD1JK30B103
C385
CHIP CERAMIC CAP. F Z 0.1
µ
F/50V or
CHD1JZB0F104
CHIP CERAMIC CAP. F Z 0.1
µ
F/25V or
CHD1EZB0F104
CHIP CERAMIC CAP. F Z 0.1
µ
F/50V or
CHD1JZ30F104
CHIP CERAMIC CAP. F Z 0.1
µ
F/25V CHD1EZ30F104
C386
CHIP CERAMIC CAP. B K 0.01
µ
F/50V or
CHD1JKB0B103
CHIP CERAMIC CAP. B K 0.01
µ
F/50V CHD1JK30B103
C387
CHIP CERAMIC CAP. CH J 150pF/50V or
CHD1JJBCH151
CHIP CERAMIC CAP. CH J 150pF/50V
CHD1JJ3CH151
C388
CHIP CERAMIC CAP. B K 2200pF/50V or
CHD1JKB0B222
CHIP CERAMIC CAP. B K 2200pF/50V
CHD1JK30B222
C389
CHIP CERAMIC CAP. B K 2200pF/50V or
CHD1JKB0B222
CHIP CERAMIC CAP. B K 2200pF/50V
CHD1JK30B222
C390
ELECTROLYTIC CAP. 2.2
µ
F/50V M or
CE1JMASDL2R2
ELECTROLYTIC CAP. 2.2
µ
F/50V M
CE1JMASTL2R2
C391
CHIP CERAMIC CAP. CH J 220pF/50V or
CHD1JJBCH221
CHIP CERAMIC CAP. CH J 220pF/50V
CHD1JJ3CH221
C393
CHIP CERAMIC CAP. CH J 22pF/50V or
CHD1JJBCH220
CHIP CERAMIC CAP. CH J 22pF/50V
CHD1JJ3CH220
C394
CHIP CERAMIC CAP. CH D 10pF/50V or
CHD1JDBCH100
CHIP CERAMIC CAP. CH D 10pF/50V
CHD1JD3CH100
C401
ELECTROLYTIC CAP. 4.7
µ
F/25V M H7
CE1EMASSL4R7
C403
CHIP CERAMIC CAP. F Z 0.1
µ
F/50V or
CHD1JZB0F104
CHIP CERAMIC CAP. F Z 0.1
µ
F/25V or
CHD1EZB0F104
CHIP CERAMIC CAP. F Z 0.1
µ
F/50V or
CHD1JZ30F104
CHIP CERAMIC CAP. F Z 0.1
µ
F/25V CHD1EZ30F104
C404
CHIP CERAMIC CAP. F Z 0.1
µ
F/50V or
CHD1JZB0F104
CHIP CERAMIC CAP. F Z 0.1
µ
F/25V or
CHD1EZB0F104
CHIP CERAMIC CAP. F Z 0.1
µ
F/50V or
CHD1JZ30F104
CHIP CERAMIC CAP. F Z 0.1
µ
F/25V CHD1EZ30F104
C405
CHIP CERAMIC CAP. B K 1000pF/50V or
CHD1JKB0B102
CHIP CERAMIC CAP. B K 1000pF/50V
CHD1JK30B102
C406
ELECTROLYTIC CAP. 47
µ
F/6.3V M H7
CE0KMASSL470
C407
ELECTROLYTIC CAP. 220
µ
F/6.3V M H7
CE0KMASSL221
C409
CERAMIC CAP. B K 470pF/100V or
CCD2AKS0B471
CERAMIC CAP. B K 470pF/500V
CCD2JKS0B471
C410
FILM CAP.(P) 0.018
µ
F/100V J or
CMA2AJS00183
FILM CAP.(P) 0.018
µ
F/50V J
CA1J183MS029
C411
CHIP CERAMIC CAP. B K 0.01
µ
F/50V or
CHD1JKB0B103
CHIP CERAMIC CAP. B K 0.01
µ
F/50V CHD1JK30B103
C412
ELECTROLYTIC CAP. 10
µ
F/16V M H7
CE1CMASSL100
C413
CERAMIC CAP.(AX) X K 1200pF/16V
CCA1CKT0X122
Ref. No.
Description
Part No.
Summary of Contents for 23C-250
Page 22: ...1 8 3 1 8 4 1 8 5 H8624SCM1 Main 1 4 Schematic Diagram...
Page 23: ...1 8 6 1 8 7 1 8 8 H8624SCM2 Main 2 4 Schematic Diagram...
Page 24: ...1 8 9 1 8 10 1 8 11 H8624SCM3 Main 3 4 Schematic Diagram...
Page 25: ...1 8 12 1 8 13 1 8 14 H8624SCM4 Main 4 4 Schematic Diagram Function Schematic Diagram H8743SCF...
Page 26: ...1 8 15 1 8 16 Jack Schematic Diagram H8622SCJ...
Page 27: ...1 8 17 1 8 18 SECAM Schematic Diagram H8624SCS...
Page 30: ...1 8 26 1 8 25 BH8700F01031 Function CBA Top View Function CBA Bottom View...
Page 31: ...1 8 28 1 8 27 BH8700F01021 Jack CBA Top View Jack CBA Bottom View...
Page 32: ...1 8 30 1 8 29 SECAM CBA Top View SECAM CBA Bottom View BH8700F01011 C...
Page 58: ...EXPLODED VIEWS Front Panel A1X 3 1 1 H8743FEX...
Page 60: ...Packing Some Ref Numbers are not in sequence S2 S2 X4 S1 X1 X2 X20 X3 Unit S3 3 1 3 H8740PEX...
Page 78: ...23C 250 23C 250A H8743FP Printed in Japan 2001 04 20 HO...