Freescale Semiconductor MC9S08PA32, Technical Data Manual

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Table 4. Supply current characteristics (continued)
Num C Parameter Symbol Bus Freq V
DD
(V) Typical
1
Max Unit Temp
7 C ADC adder to stop3
ADLPC = 1
ADLSMP = 1
ADCO = 1
MODE = 10B
ADICLK = 11B
— — 5 44 — µA -40 to 105 °C
C 3 40 —
8 C LVD adder to stop3
4
— — 5 130 — µA -40 to 105 °C
C 3 125 —
1. Data in Typical column was characterized at 5.0 V, 25 °C or is typical recommended value.
2. RTC adder cause <1 µA I
DD
increase typically, RTC clock source is 1 kHz LPO clock.
3. ACMP adder cause <1 µA I
DD
increase typically.
4. LVD is periodically woken up from stop3 by 5% duty cycle. The period is equal to or less than 2 ms.
5.1.3 EMC performance
Electromagnetic compatibility (EMC) performance is highly dependant on the
environment in which the MCU resides. Board design and layout, circuit topology
choices, location and characteristics of external components as well as MCU software
operation all play a significant role in EMC performance. The system designer should
consult Freescale applications notes such as AN2321, AN1050, AN1263, AN2764, and
AN1259 for advice and guidance specifically targeted at optimizing EMC performance.
Switching specifications
5.2.1 Control timing
Table 5. Control timing
Num C Rating Symbol Min Typical
1
Max Unit
1 P Bus frequency (t
cyc
= 1/f
Bus
) f
Bus
DC — 20 MHz
2 P Internal low power oscillator frequency f
LPO
0.67 1.0 1.25 KHz
3 D External reset pulse width t
extrst
1.5 ×
t
Self_reset
— — ns
4 D Reset low drive t
rstdrv
34 × t
cyc
— — ns
5 D BKGD/MS setup time after issuing background
debug force reset to enter user or BDM modes t
MSSU
500 — — ns
6 D BKGD/MS hold time after issuing background
debug force reset to enter user or BDM modes
3
t
MSH
100 — — ns
Table continues on the next page...
5.2
Switching specifications
MC9S08PA60 Series Data Sheet, Rev. 1, 10/9/2012.
Freescale Semiconductor, Inc. 13