©2006 Fairchild Semiconductor Corporation
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FSAM50SM60A Rev. C4
FSAM50SM60A Moti
on
SPM®
2 Series
Detailed Package Outline Drawings
Package drawings are provided as a service to customers considering Fairchild components. Drawings may change in any
manner without notice. Please note the revision and/or data on the drawing and contact a FairchildSemiconductor
representative to verify or obtain the most recent revision. Package specifications do not expand the terms of Fairchild’s
worldwide therm and conditions, specifically the the warranty therein, which covers Fairchild products.
Always visit Fairchild Semiconductor’s online packaging area for the most recent package drawings:
http://www.fairchildsemi.com/dwg/MO/MOD32BA.pdf
