Euresys Coaxlink 1629, Hardware Manual

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WARNING
The thermal design of the host PC must ensure that, at any time, the FPGA
die temperature never exceeds the recommended limit.
WARNING
Exceeding the upper limit of the FPGA die temperature can permanently
damage the card.
NOTE
For PCIe/104 products only, the ambient air temperature specification
applies to any point in the vicinity of the module including the gap between
modules of the PCIe/104 stack.
4.2. Temperature Monitor
FPGA die temperature sensor
All Coaxlink cards embed a temperature sensor on the FPGA die.
When the TemperatureSensorSelector feature of the Interface Module is set to Grabber , the
Temperature feature of the Interface Module reports the FPGA die temperature expressed in °C.
The user application is invited to check regularly the FPGA die temperature to ensure that the
board operates within the specified operating limits.
See also: "Environmental Conditions" on the previous page
Coaxlink Hardware Manual