SED1520 Series
2–4
EPSON
PAD
Pad Arrangement
Chip specifications of AL pad package
Chip size: 4.80
×
7.04
×
0.400 mm
Pad pitch: 100
×
100
µ
m
Chip specifications of gold bump package
Chip size:
4.80
×
7.04
×
0.525 mm
Bump pitch:
199
µ
m (Min.)
Bump height: 22.5
µ
m (Typ.)
Bump size:
132
×
111
µ
m (
±
20
µ
m) for mushroom
model
116
×
92
µ
m (
±
4
µ
m) for vertical model
Note: An example of SED1520D
AA
die numbers is given. These numbers are the same as the bump
package.
100
95
90
85
1
5
10
15
20
25
30
35
40
45
50
55
60
65
70
75
80
D1520D *
AA
X
Y
4.80 mm
7.04 mm
(0, 0)
