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                                                          Bluetooth Low Energy Module    

   

                                                    

Shanghai Ehong Technologies Co., Ltd

 

6.  Physical Interfaces 

6.1.  Power Supply  

The module power supply 3v coin cell batteries or DC 3.3v 

Power supply pin connection capacitor to chip and pin as far as possible close 

Capacitor decouples power to the chip  

Capacitor prevents noise coupling back to power plane. 

 

Figure 2

 Power Supply PCB Design 

 

6.2.  PIO 

10 PIOs are provided (4 are multiplexed with SPI debug interface). They are powered 
from VDD_PIO. 
PIO lines are software-configurable as weak pull-up, weak pull-down, strong pull-up or 
strong pull-down. 

Note:  

At reset all PIO lines are inputs with weak pull-downs.  
Any of the PIO lines can be configured as interrupt request lines or as wake-up lines from sleep 
modes. 

6.3.  AIO 

3 AIOs are provided. They can be connected to internal 10 bits ADC. Their functions 
depend on software. They can be used to read or output a voltage between 0V to 1.3V. 
Each of them can be used as a digital output with special firmware. 

6.4.  PWM 

4 PIOs (PIO3, PIO4, PIO9, and PIO10) can be driven by internal PWM module. The 
PWM module also works while the module is sleep. So it can be used as a LED flasher. 
These functions are controlled by special firmware. 

Summary of Contents for EH-MC10

Page 1: ...ter and slave The generic attribute profile GATT Health care Sports and fitness Proximity sensing profiles Alerts and timer profiles User interface Send AT command over UART Firmware upgrade over the...

Page 2: ...al Characteristics 5 4 4 Power Consumption 6 5 Pinout and Terminal Description 7 5 1 Pin Configuration 7 6 Physical Interfaces 9 6 1 Power Supply 9 6 2 PIO 9 6 3 AIO 9 6 4 PWM 9 6 5 UART 10 6 6 I2C Ma...

Page 3: ...MINAL DESCRIPTION 8 TABLE 8 POSSIBLE UART SETTINGS 10 3 Table of Figures FIGURE 1 PINOUT OF EH MC10 7 FIGURE 2 POWER SUPPLY PCB DESIGN 9 FIGURE 3 CONNECTION TO HOST DEVICE 10 FIGURE 4 REFERENCE DESIGN...

Page 4: ...batteries In lowest power sleep mode it consumes only 600nA and will wake up in few hundred microseconds After buying Bluetooth module we provide free technical support APP of iOS system or APP Andro...

Page 5: ...ics Input Voltage Levels Min Typical Max Unit VIL input logic level low 0 4 0 4 V VIH input logic level high 0 7 x VDD VDD 0 4 V Tr Tf 25 ns Output Voltage Levels Min Typical Max Unit VOL output logic...

Page 6: ...Contact Discharge per JEDEC EIA JESD22 C101 III 500V all pins 4 4 Power Consumption The current consumption are measured at the VBAT Table 6 Current Consumption Mode Description Total typical current...

Page 7: ...programmable I O line UART_TX 5 CMOS output tristate with weak internal pull up UART data output UART_RX 6 CMOS input with weak internal pull down UART data input PIO3 7 Bi directional with programmab...

Page 8: ...pply PIO8 SPI_MISO 17 Bi directional with programmable strength internal pull up down Programmable input output line Or debug SPI_MISO selected by SPI_PIO_SEL PIO9 18 Bi directional with programmable...

Page 9: ...igurable as weak pull up weak pull down strong pull up or strong pull down Note At reset all PIO lines are inputs with weak pull downs Any of the PIO lines can be configured as interrupt request lines...

Page 10: ...2C Master The module can act as an I2C master when configured by software Any two PIOs can be configured as I2C_SCL and I2C_SDA 6 7 SPI Master The module can act as an SPI master mode 0 when configure...

Page 11: ...Considerations 8 1 Soldering Recommendations EH MC10 is compatible with industrial standard reflow profile for Pb free solders The reflow profile used is dependent on the thermal mass of the entire po...

Page 12: ...A low residue no clean solder paste should be used due to low mounted height of the component 8 2 Layout Guidelines For optimal performance of the antenna place the module at the corner of the PCB as...

Page 13: ...Bluetooth Low Energy Module Shanghai Ehong Technologies Co Ltd 9 Mechanical and PCB Footprint Characteristics Figure 6 Physical Dimensions and Recommended Footprint Unit mm Deviation 0 02mm...

Page 14: ...ure and liquefaction of flux each activator and rosin get activated and start eliminating oxide film formed on the surface of each solder particle and PCB board The temperature is recommended to be 15...

Page 15: ...i Ehong Technologies Co Ltd 11 Contact Information Sales sales ehlink com cn Technical support support ehlink com cn Phone 86 21 61139798 Fax 86 21 61263536 Street address Rom501 No 3 building 439 jin...

Page 16: ...This Transmitter must not be co located or operating in conjunction with any other antenna or transmitter 2 This equipment complies with FCC RF radiation exposure limits set forth for an uncontrolled...

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