Bluetooth Low Energy Module
Shanghai Ehong Technologies Co., Ltd
6.8. SPI Debug
The SPI Debug interface is chosen when SPI_PIO_S is high. The interface is used to
program and debug the module. So always place test points or header on PCB for this
interface and SPI_PIO_SEL.
7. Reference Design
Figure 4
：
Reference Design
8. Layout and Soldering Considerations
8.1. Soldering Recommendations
EH-MC10 is compatible with industrial standard reflow profile for Pb-free solders. The
reflow profile used is dependent on the thermal mass of the entire populated PCB, heat
transfer efficiency of the oven and particular type of solder paste used. Consult the
datasheet of particular solder paste for profile configurations.
Comply will give following recommendations for soldering the module to ensure reliable
solder joint and operation of the module after soldering. Since the profile used is
