Ehong EH-MC10, Manual

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Bluetooth Low Energy Module
Shanghai Ehong Technologies Co., Ltd
1. Contents
1. Description
.................................................................................................................................................. 3
2. Applications ................................................................................................................................................ 4
3. EH-MC10 Product numbering
.................................................................................................................. 4
4. Electrical Characteristics
......................................................................................................................... 4
4.1. Recommended Operation Conditions ................................................................................................. 4
4.2. Absolute Maximum Rating ................................................................................................................... 5
4.3. Input/Output Terminal Characteristics
................................................................................................ 5
4.4. Power Consumption
............................................................................................................................. 6
5. Pinout and Terminal Description ............................................................................................................. 7
5.1. Pin Configuration .................................................................................................................................. 7
6. Physical Interfaces .................................................................................................................................... 9
6.1. Power Supply ........................................................................................................................................ 9
6.2. PIO ......................................................................................................................................................... 9
6.3. AIO
......................................................................................................................................................... 9
6.4. PWM
...................................................................................................................................................... 9
6.5. UART ................................................................................................................................................... 10
6.6. I2C Master
........................................................................................................................................... 10
6.7. SPI Master
.......................................................................................................................................... 10
6.8. SPI Debug ........................................................................................................................................... 11
7. Reference Design ..................................................................................................................................... 11
8. Layout and Soldering Considerations
................................................................................................. 11
8.1. Soldering Recommendations
............................................................................................................ 11
8.2. Layout Guidelines ............................................................................................................................... 12
9. Mechanical and PCB Footprint Characteristics
................................................................................. 13
10. Reflow Profile ........................................................................................................................................ 14
11. Contact Information ............................................................................................................................. 15