SX127X RF Module
User Manual of E19 Series Modules
Copyright ©2012–2018，Chengdu Ebyte Electronic Technology Co.,Ltd
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4. Remark
DIO0、DIO1、DIO2、DIO3、DIO4、DIO5 is generally purpose I/O, can be configured into multiple function,please check SX1278/SX1276
manual for more details, floating is allowed.
RST, TXEN, RXEN pin must be connected, in which RST control the reset of chip, TXEN, RXEN pin control RF switch.
Make sure the grounding is good, with low power ripple, also should increase filter capacitor and as close as possible to the VCC and
GND pins.
SPI communication rate should not be set too high, usually around 1M.
Make sure TXEN pin is high level, RXEN pin is low level when transmitting.
make sure RXEN pin is high level, TXEN pin is low level when receiving.
make sure TXEN、RXEN pin is low level before turning off.
The register configuration can be reinitialized to obtain higher stability when the chip is invalid.
5. Production Guidance
5.1 Reflow Temperature
Profile Feature
Sn-Pb Assembly
Pb-Free Assembly
Solder Paste
Sn63/Pb37
Sn96.5/Ag3/Cu0.5
Preheat Temperature min （Tsmin）
100℃
150℃
Preheat temperature max (Tsmax)
150℃
200℃
Preheat Time (Tsmin to Tsmax)(ts)
60-120 sec
60-120 sec
Average ramp-up rate(Tsmax to Tp)
3℃/second max
3℃/second max
Liquidous Temperature (TL)
183℃
217℃
Time（tL）Maintained Above（TL）
60-90 sec
30-90 sec
Peak temperature（Tp）
220-235℃
230-250℃
Aveage ramp-down rate（Tp to Tsmax）
6℃/second max
6℃/second max
Time 25℃ to peak temperature
6 minutes max
8 minutes max
