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a cold wind Then elevate the upper heater, make the gap has 3-5mm
space between the bottom of nozzle and the upper surface of BGA chip
and keep cooling for 30-40 seconds, or move away the main heater after
the starting light is off, finally take away the PCB board from the
support
5.Before installation of BGA, it is necessary to check that if the PCB pad
and BGA tin bead are all in good condition It is necessary to check the
outlet after welding and to stop installation if you find something
unusual Go on welding after anything is normal, or the BGA and PCB
board will be damaged
6.The machine surface needs to be clean at regular time, especially the infrared
heating board Avoid the dirt stay on the board, because the dirt can lead to heat
radiation unnormally, bad welding quality and shorten the using time of infrared
heating element
If the heating element was burn out because of this, our company is not
responsible for it and no free charge!
Conclusion:
In the electric products line, especially the PC and electric
production field, component trend to microminiaturization, multi function and
greening of management, various capsulation technology spring up, and BGA/CSP
is the main trend
In order to satisfy the growing need of BGA device circuit assembly,
manufacturers should choose more safe, more convenient, more speedily
assembly and repair equipment craft
