19
2).
Select the proper profile, choose the mouting model Then click
3).
The upper sucker will goes down to
welding position as settled in picture 6
to pick up the BGA chip, and goes up the Optic position settled in picture 6
,
4).
Pull the optical lens out, the BGA tin ball and welding pad will be displayed on the
screen You can check images of tin balls on the screen through the adjusting angle
handle.X axis.Y axis The tin ball and PCB welding position must be coincide
completely on the screen
5).
Push the CCD carmera back, the screen will appear like this. Click yes to soldering
the chip
8. Soldering
1
. Switch on the power, select the proper stored temp profile or set for yourself if
needed.
2
. Switch on the laser, put the BGA soldering pad center to the laser. Fasten the
supporter. Install the proper nozzle, 2mm-3mm larger than the BGA.
2. Install the right nozzle 2mm larger than the BGA chip,
click
.heating as your chosen data Cool the BGA chip after the procedure
finished Raise the upper heater to make the bottom of upper heater has 3-5mm
distance from the upper surface of BGA chip, and keep cooling for 30-40 seconds
Or you can move away the warm heater after the starting light off Then take away
the PCB board from the supporter
(1) Null welding:
