15
areas depend on the PCB
board size.
2. You should set different temperature curves when repair different BGA,each temperature
should not higher than 300
℃；
Lead-free rework setting can refer to welding temperature curve of
BGA tin bead.
3. When demount BGA,the cooling fan and vacuum should be setted to automatic
transmission,the buzzer will warn automatically when temperature curve runs to the
end.Meanwhile, remove the BGA from PCB board with vacuum pen, and then remove the PCB
board from the positioning frame.
4.When welding the BGA chip,set the cooling fan to manual grade
、
close vaccum.After the
temperature curve runs to the end, the buzzer will alarm automatically,the cooling fan begins to
cooling the BGA chip and bottom heating zone,meanwhile,the warm heating head will blow a
cold wind.Then elevate the upper heater,make the gap has 3-5mm space between the bottom of
nozzle and the upper surface of BGA chipand keep cooling for 30-40 seconds,or move away the
main heater after the starting light is off,finally take away the PCB boaed from the support.
5. Before installation of BGA chip, it is necessary to check that if the PCB pad and BGA tin bead
are all in good condition.After welding, it have to check the exterior appearance by piece, if it is
unusual, it should stop the BGA chip installation and test the temperature, and it has to be adjusted
properly before welding, otherwise it will be damage the BGA chip or PCB board.
6. The machine surface needs to be clean at regular time, especially the infrared heating board.
Avoid the dirt stay on the board, because the dirt can lead to heat radiation unnormally, bad
welding quality and shorten the using time of infrared heating element.
If the heating element was burn out because of these, our company is not
responsible for free change!
Concluding remarks:
In the electric products line,especially the PC and elec tric production
field,component trend to
microminiaturization
、
multi Function and greening of
management,various capsulation technology spring up, and BGA/CSP is the main
trend.
In order to satisfy the growing need of BGA device circuit assembly,
manufacturers should choose safer, more convenient, more speedily assembly and
repair equipment craft.
