65
TAS5142DKD (AMP
: IC118)
TAS5142 Pin Discriptions
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GENERAL INFORMATION
Terminal Assignment
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
36
35
34
33
32
31
30
29
28
27
26
25
24
23
22
21
20
19
GVDD_B
OTW
SD
PWM_A
RESET_AB
PWM_B
OC_ADJ
GND
AGND
VREG
M3
M2
M1
PWM_C
RESET_CD
PWM_D
VDD
GVDD_C
GVDD_A
BST_A
PVDD_A
OUT_A
GND_A
GND_B
OUT_B
PVDD_B
BST_B
BST_C
PVDD_C
OUT_C
GND_C
GND_D
OUT_D
PVDD_D
BST_D
GVDD_D
DKD PACKAGE
(TOP VIEW)
P0018-01
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
GVDD_B
OTW
NC
NC
SD
PWM_A
RESET_AB
PWM_B
OC_ADJ
GND
AGND
VREG
M3
M2
M1
PWM_C
RESET_CD
PWM_D
NC
NC
VDD
GVDD_C
DDV PACKAGE
(TOP VIEW)
GVDD_A
BST_A
NC
PVDD_A
PVDD_A
OUT_A
GND_A
GND_B
OUT_B
PVDD_B
BST_B
BST_C
PVDD_C
OUT_C
GND_C
GND_D
OUT_D
PVDD_D
PVDD_D
NC
BST_D
GVDD_D
44
43
42
41
40
39
38
37
36
35
34
33
32
31
30
29
28
27
26
25
24
23
P0016-02
TAS5142
SLES126B–DECEMBER 2004–REVISED MAY
2005
These
devices have limited built-in
ESD
protection.
The
leads should be shorted together or the device
placed in conductive foam during storage or handling to prevent electrostatic damage to the MOS gates.
The TAS5142
is available in two thermally enhanced
packages:
•
36-pin PSOP3
package (DKD)
•
44-pin
HTSSOP
PowerPad™
package
(DDV)
Both
package
types contain a heat slug that is located on the top side of the device for convenient thermal
coupling to the
heatsink.
2
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Terminal Functions
TAS5142
SLES126B–DECEMBER 2004–REVISED MAY
2005
TERMINAL
FUNCTION
(1)
DESCRIPTION
NAME
DKD NO.
DDV NO.
AGND
9
11
P
Analog ground
BST_A
35
43
P
HS bootstrap supply
(BST),
external capacitor to
OUT_A
required
BST_B
28
34
P
HS bootstrap supply
(BST),
external capacitor to
OUT_B
required
BST_C
27
33
P
HS bootstrap supply
(BST),
external capacitor to
OUT_C
required
BST_D
20
24
P
HS bootstrap supply
(BST),
external capacitor to
OUT_D
required
GND
8
10
P
Ground
GND_A
32
38
P
Power ground for half-bridge A
GND_B
31
37
P
Power ground for half-bridge B
GND_C
24
30
P
Power ground for half-bridge C
GND_D
23
29
P
Power ground for half-bridge D
GVDD_A
36
44
P
Gate-drive voltage supply requires 0.1-
µ
F
capacitor to AGND
GVDD_B
1
1
P
Gate-drive voltage supply requires 0.1-
µ
F
capacitor to AGND
GVDD_C
18
22
P
Gate-drive voltage supply requires 0.1-
µ
F
capacitor to AGND
GVDD_D
19
23
P
Gate-drive voltage supply requires 0.1-
µ
F
capacitor to AGND
M1
13
15
I
Mode selection pin
M2
12
14
I
Mode selection pin
M3
11
13
I
Mode selection pin
NC
–
3, 4, 19, 20, 25,
–
No connect. Pins may be grounded.
42
OC_ADJ
7
9
O
Analog overcurrent programming pin requires resistor to ground
OTW
2
2
O
Overtemperature warning
signal, open-drain,
active-low
OUT_A
33
39
O
Output,
half-bridge A
OUT_B
30
36
O
Output,
half-bridge B
OUT_C
25
31
O
Output,
half-bridge C
OUT_D
22
28
O
Output,
half-bridge D
PVDD_A
34
40,
41
P
Power supply input for half-bridge A requires close decoupling of
0.1-
µ
F
capacitor to
GND_A.
PVDD_B
29
35
P
Power supply input for half-bridge B requires close decoupling of
0.1-
µ
F
capacitor to
GND_B.
PVDD_C
26
32
P
Power supply input for half-bridge C requires close decoupling of
0.1-
µ
F
capacitor to
GND_C.
PVDD_D
21
26,
27
P
Power supply input for half-bridge D requires close decoupling of
0.1-
µ
F
capacitor to
GND_D.
PWM_A
4
6
I
Input signal for half-bridge A
PWM_B
6
8
I
Input signal for half-bridge B
PWM_C
14
16
I
Input signal for half-bridge C
PWM_D
16
18
I
Input signal for half-bridge D
RESET_AB
5
7
I
Reset signal for half-bridge A and half-bridge
B,
active-low
RESET_CD
15
17
I
Reset signal for half-bridge C and half-bridge
D,
active-low
SD
3
5
O
Shutdown
signal, open-drain,
active-low
VDD
17
21
P
Power supply for digital voltage regulator requires 0.1-
µ
F
capacitor
to GND.
VREG
10
12
P
Digital regulator supply filter pin requires 0.1-
µ
F
capacitor to AGND.
(1) I
= input,
O
= output,
P
=
power
5
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