DATASONICS SIS-1500, System Manual

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SIS-1500 Seafloor Imaging System 4-3
SECTION 4 Theory of Operation Topside Processor Electronics
n overall understanding of how the SIS-1500 Seafloor Imaging
System produces the high resolution sidescan sonar images is an
important factor in ensuring that the system is properly maintained
and its maximum performance realized. This section provides an overall
functional description of the system hardware components, signal flows and
processing, from the generation of the transmit signals to the acquisition and
processing of the received signals. Refer to Section 6, "Drawings,"
for the
wiring diagrams and assembly drawings called out in this section.
For descriptive purposes the system’s electronics hardware is divided into
two major functional components: the topside processor electronics and the
subsea electronics. They are connected with a single coaxial cable. The
topside processor electronics is the electronics hardware component of the
SIP-150 Sonar Image Processor. The subsea electronics is the electronics
hardware component of the TTV-195 Tow Vehicle.
Topside Processor Electronics
A block diagram of the SIP-150 Sonar Image Processor, which comprises the
SIP-150 Sonar Image Processor Workstation and the Chirplink II Digital
Multiplexer, is shown in Figure 4-1. Also refer to the wiring diagram for the
digital multiplexer, which is shown Drawing B150-08365.
With the exception of the Synchronizer board in the workstation and the
Multiplexer board in the digital multiplexer, all the circuit boards are OEM
supplied. Refer to the appropriate reference material provided by the
manufacturer for these boards. Listed below are the assembly drawing
numbers for the Synchronizer and Multiplexer boards.
Circuit Board Assembly Drawing
Synchronizer: B150-08061
Multiplexer: B150-08305
A