3
PATH FIXTURE CONNECTION/TEST POINT IDENTIFICATION
1. Preparation for replacement
a. Soldering Iron
Use a pencil-type soldering iron that uses less than 30
watts.
b. Solder
Eutectic solder (Tin 63%, Lead 37%) is recommended.
c. Soldering time
Do not apply heat more than 4 seconds.
d. Preheating
Leadless capacitor must be preheated before installation.
(130°C~150°C, for about two minutes).
2. Removing the leadless component (Resistors, Capacitors)
Grasp the leadless component body with tweezers and alter-
nately apply heat to both electrodes. When the solder on both
electrodes is melted, remove leadless component with a twist-
ing motion.
LEADLESS (CHIP) COMPONENT REMOVAL INSTRUCTION
Note:
a. Leadless component must not be reused after removal.
b. Excessive mechanical stress and rubbing of the compo-
nent electrode must be avoided.
Note:
a. Do not attempt to lift the component off the board until
the component is completely disconnected from the
board by a twisting action.
b. Take care not to break the copper foil on printed board.
• The following procedures are recommended for the replacement of the leadless components used in this unit.
Chip
Tweezers
Soldering lron
Refer to the adjustment of the tape transporting system.
Connect to PT01
!
pin-
^
pin of the
MAIN CIRCUIT BOARD.
CTL pulse test point
GND
S/W pulse test point
ENVE pulse test point
!
^
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Summary of Contents for DR-C912B
Page 13: ...11 INSTRUMENT DISASSEMBLY All manuals and user guides at all guides com...
Page 39: ...37 EXPLODED VIEW 6 3 EXPLODED VIEW OF FL ASS Y All manuals and user guides at all guides com...
Page 44: ...42 WAVEFORMS VIDEO WAVEFORMS 480 4 6 20 34 All manuals and user guides at all guides com...
Page 114: ...NORMAL AUDIO BLOCK DIAGRAM 112 BLOCK DIAGRAM All manuals and user guides at all guides com...
Page 117: ...AMP BLOCK DIAGRAM 115 BLOCK DIAGRAM All manuals and user guides at all guides com...
