background image

CY62167EV18 MoBL

®

16 Mbit (1M x 16) Static RAM

Cypress Semiconductor Corporation

198 Champion Court

San Jose

,

CA 95134-1709

408-943-2600

Document #: 38-05447 Rev. *G

 Revised March 13, 2009

Features

Very high speed: 55 ns

Wide voltage range: 1.65V to 2.25V

Ultra low standby power

Typical standby current: 1.5

 

μ

A

Maximum standby current: 12

 

μ

A

Ultra low active power

 

Typical active current: 2.2 mA at f = 1 MHz

Easy memory expansion with CE

1

, CE

2

, and OE features

Automatic power down when deselected

CMOS for optimum speed and power

Offered in Pb-free 48-ball VFBGA packages

Functional Description

The CY62167EV18 is a high performance CMOS static RAM

organized as 1M words by 16 bits. This device features

advanced circuit design to provide ultra low active current. This

is ideal for providing More Battery Life

 (MoBL

®

) in portable

applications such as cellular telephones. The device also has an

automatic power down feature that reduces power consumption

by 99 percent when addresses are not toggling. Place the device

into standby mode when deselected (CE

1

 HIGH or CE

LOW or

both BHE and BLE are HIGH). The input and output pins (I/O

0

through I/O

15

) are placed in a high impedance state when: the

device is deselected (CE

1

HIGH or CE

2

 LOW); outputs are

disabled (OE HIGH); both Byte High Enable and Byte Low

Enable are disabled (BHE, BLE HIGH); and a write operation is

in progress (CE

1

 LOW, CE

2

 HIGH and WE LOW).

To write to the device, take Chip Enables (CE

LOW and CE

2

HIGH) and Write Enable (WE) input LOW. If Byte Low Enable

(BLE) is LOW, then data from I/O pins (I/O

0

 through I/O

7

) is

written into the location specified on the address pins (A

0

 through

A

19

). If Byte High Enable (BHE) is LOW, then data from I/O pins

(I/O

8

 through I/O

15

) is written into the location specified on the

address pins (A

0

 through A

19

).

To read from the device, take Chip Enables (CE

LOW and CE

2

HIGH) and Output Enable (OE) LOW while forcing the Write

Enable (WE) HIGH. If Byte Low Enable (BLE) is LOW, then data

from the memory location specified by the address pins appears

on I/O

0

 to I/O

7

. If Byte High Enable (BHE) is LOW, then data from

memory appears on I/O

8

 to I/O

15

. See the 

Truth Table on page

9

 for a complete description of read and write modes.

For best practice recommendations, refer to the Cypress 

application note 

AN1064, SRAM System Guidelines

.

Power Down

Circuit

BHE
BLE

CE

2

CE

1

1M × 16

RAM ARRAY

IO

0

–IO

7

ROW DECODER 

8

7

6

5

2

COLUMN DECODER

A

11

A

12

A

13

A

14

A

15

SENSE AMPS

DATA IN DRIVERS

OE

4

3

IO

8

–IO

15

WE

BLE

BHE

A

16

0

1

A

17

A

18

A

10

CE

2

CE

1

A

19

Logic Block Diagram

[+] Feedback 

Summary of Contents for CY62167EV18

Page 1: ...when the device is deselected CE1HIGH or CE2 LOW outputs are disabled OE HIGH both Byte High Enable and Byte Low Enable are disabled BHE BLE HIGH and a write operation is in progress CE1 LOW CE2 HIGH and WE LOW To write to the device take Chip Enables CE1 LOW and CE2 HIGH and Write Enable WE input LOW If Byte Low Enable BLE is LOW then data from I O pins I O0 through I O7 is written into the locat...

Page 2: ...4 IO15 VSS A9 A8 OE Vss A7 IO0 BHE CE2 A17 A2 A1 BLE VCC IO2 IO1 IO3 IO4 IO5 IO6 IO7 A15 A14 A13 A12 A19 A18 NC 3 2 6 5 4 1 D E B A C F G H A16 NC Vcc Notes 1 The information related to 6 x 7 x 1 mm VFBGA package is preliminary 2 NC pins are not connected on the die 3 Ball H6 for the VFBGA package can be used to upgrade to a 32M density 4 Typical values are included for reference only and are not ...

Page 3: ...65V to 2 25V 0 2 0 4 V IIX Input Leakage Current GND VI VCC 1 1 μA IOZ Output Leakage Current GND VO VCC Output Disabled 1 1 μA ICC VCC Operating Supply Current f fmax 1 tRC VCC VCC max IOUT 0 mA CMOS levels 25 30 mA f 1 MHz 2 2 4 0 mA ISB1 Automatic CE Power Down Current CMOS Inputs CE1 VCC 0 2V or CE2 0 2V VIN VCC 0 2V VIN 0 2V f fmax Address and Data Only f 0 OE WE BHE and BLE VCC VCC max 1 5 1...

Page 4: ... for Data Retention 1 0 V ICCDR 9 Data Retention Current VCC 1 0V CE1 VCC 0 2V CE2 0 2V VIN VCC 0 2V or VIN 0 2V 10 μA tCDR 10 Chip Deselect to Data Retention Time 0 ns tR 11 Operation Recovery Time tRC ns Figure 3 Data Retention Waveform VCC VCC OUTPUT R2 30 pF INCLUDING JIG AND SCOPE GND 90 10 90 10 Rise Time 1 V ns Fall Time 1 V ns OUTPUT V Equivalent to THÉVENIN EQUIVALENT ALL INPUT PULSES RTH...

Page 5: ...to Write End 25 ns tHD Data Hold from Write End 0 ns tHZWE WE LOW to High Z 15 16 20 ns tLZWE WE HIGH to Low Z 15 10 ns Notes 13 Test conditions for all parameters other than tri state parameters are based on signal transition time of 1V ns timing reference levels of VCC typ 2 input pulse levels of 0 to VCC typ and output loading of the specified IOL IOH as shown in AC Test Loads and Waveforms on ...

Page 6: ... PREVIOUS DATA VALID DATA VALID RC tAA tOHA tRC ADDRESS DATA OUT 50 50 DATA VALID tRC tACE tDOE tLZOE tLZCE tPU HIGH IMPEDANCE tHZOE tPD tHZBE tLZBE tHZCE tDBE OE CE1 ADDRESS CE2 BHE BLE DATA OUT VCC SUPPLY CURRENT HIGH ICC ISB IMPEDANCE Notes 18 The device is continuously selected OE CE1 VIL BHE BLE or both VIL and CE2 VIH 19 WE is HIGH for read cycle 20 Address valid before or similar to CE1 BHE...

Page 7: ...orms continued tHD tSD tPWE tSA tHA tAW tSCE tWC tHZOE VALID DATA tBW NOTE 23 CE1 ADDRESS CE2 WE DATA I O OE BHE BLE Notes 21 Data IO is high impedance if OE VIH 22 If CE1 goes HIGH and CE2 goes LOW simultaneously with WE VIH the output remains in a high impedance state 23 During this period the IOs are in output state Do not apply input signals Feedback ...

Page 8: ...cle No 2 Figure 8 shows WE controlled OE LOW write cycle waveforms 22 Figure 8 Write Cycle No 3 Switching Waveforms continued tHD tSD tPWE tHA tAW tSCE tWC tHZOE VALID DATA tBW tSA NOTE 23 CE1 ADDRESS CE2 WE DATA I O OE BHE BLE VALID DATA tHD tSD tLZWE tPWE tSA tHA tAW tSCE tWC tHZWE tBW NOTE 23 CE1 ADDRESS CE2 WE DATA I O BHE BLE Feedback ...

Page 9: ...Read Active ICC L H H L H L Data Out I O0 I O7 High Z I O8 I O15 Read Active ICC L H H L L H High Z I O0 I O7 Data Out I O8 I O15 Read Active ICC L H H H L H High Z Output Disabled Active ICC L H H H H L High Z Output Disabled Active ICC L H H H L L High Z Output Disabled Active ICC L H L X L L Data In I O0 I O15 Write Active ICC L H L X H L Data In I O0 I O7 High Z I O8 I O15 Write Active ICC L H...

Page 10: ...297 48 ball VFBGA 6 7 1 mm Pb free Industrial CY62167EV18LL 55BVI 51 85150 48 ball VFBGA 6 8 1 mm CY62167EV18LL 55BVXI 48 ball VFBGA 6 8 1 mm Pb free CY62167EV30LL 45BVI 5 51 85150 48 ball VFBGA 6 8 1 mm Package Diagram Figure 10 48 Ball VFBGA 6 x 7 x 1 mm 001 13297 NOTES 1 ALL DIMENSION ARE IN MM MAX MIN 2 JEDEC REFERENCE MO 216 3 PACKAGE WEIGHT 0 03g 001 13297 A Feedback ...

Page 11: ...ram A 1 A1 CORNER 0 75 0 75 Ø0 30 0 05 48X Ø0 25 M C A B Ø0 05 M C B A 0 15 4X 0 21 0 05 1 00 MAX C SEATING PLANE 0 55 MAX 0 25 C 0 10 C A1 CORNER TOP VIEW BOTTOM VIEW 2 3 4 3 75 5 25 B C D E F G H 6 5 4 6 5 2 3 1 D H F G E C B A 6 00 0 10 8 00 0 10 A 8 00 0 10 6 00 0 10 B 1 875 2 625 0 26 MAX 51 85150 D Feedback ...

Page 12: ... tHZWE from 15 ns to 18 ns Changed tSCE tAW and tBW from 40 ns to 35 ns Changed tPE from 30 ns to 35 ns Changed tSD from 20 ns to 25 ns Updated 48 ball FBGA Package Information Updated the Ordering Information table B 469182 NSI See ECN Minor Change Moved to external web C 619122 NXR See ECN Replaced 45 ns speed bin with 55 ns speed bin D 1130323 VKN See ECN Converted from preliminary to final Add...

Page 13: ... firmware in support of licensee product to be used only in conjunction with a Cypress integrated circuit as specified in the applicable agreement Any reproduction modification translation compilation or representation of this Source Code except as specified above is prohibited without the express written permission of Cypress Disclaimer CYPRESS MAKES NO WARRANTY OF ANY KIND EXPRESS OR IMPLIED WIT...

Reviews: