Document Number: 002-00856 Rev. *E
S29JL064J
20.2
VBK048—48-Pin FBGA
g1001.2 \ f16-038.25 \ 07.13.10
NOTES:
1.
DIMENSIONING AND TOLERANCING PER ASME Y14.5M-1994.
2.
ALL DIMENSIONS ARE IN MILLIMETERS.
3.
BALL POSITION DESIGNATION PER JESD 95-1, SPP-010 (EXCEPT
AS
NOTED).
4.
e REPRESENTS THE SOLDER BALL GRID PITCH.
5.
SYMBOL "MD" IS THE BALL ROW MATRIX SIZE IN THE
"D"
DIRECTION.
SYMBOL "ME" IS THE BALL COLUMN MATRIX SIZE IN THE
"E"
DIRECTION.
N IS THE TOTAL NUMBER OF SOLDER BALLS.
6
DIMENSION "b" IS MEASURED AT THE MAXIMUM BALL
DIAMETER IN A PLANE PARALLEL TO DATUM C.
7
SD AND SE ARE MEASURED WITH RESPECT TO DATUMS
A AND B AND DEFINE THE POSITION OF THE CENTER
SOLDER BALL IN THE OUTER ROW.
WHEN THERE IS AN ODD NUMBER OF SOLDER BALLS IN
THE OUTER ROW PARALLEL TO THE D OR E DIMENSION,
RESPECTIVELY, SD OR SE = 0.000.
WHEN THERE IS AN EVEN NUMBER OF SOLDER BALLS IN
THE OUTER ROW, SD OR SE = e/2
8.
NOT USED.
9.
"+" INDICATES THE THEORETICAL CENTER OF DEPOPULATED
BALLS.
10 A1 CORNER TO BE IDENTIFIED BY CHAMFER, LASER OR INK
MARK, METALLIZED MARK INDENTATION OR OTHER MEANS.
PACKAGE VBK
048
JEDEC N/A
8.15 mm x 6.15 mm NOM
PACKAGE
SYMBOL MIN NOM MAX
NOTE
A
---
---
1.00 OVERALL
THICKNESS
A1
0.18
---
--- BALL
HEIGHT
D
8.15
BSC.
BODY
SIZE
E
6.15
BSC.
BODY
SIZE
D1
5.60
BSC.
BALL
FOOTPRINT
E1
4.00
BSC.
BALL
FOOTPRINT
MD
8
ROW MATRIX SIZE D DIRECTION
ME
6
ROW MATRIX SIZE E DIRECTION
N 48
TOTAL
BALL
COUNT
φ
b 0.33 --- 0.43
BALL
DIAMETER
e
0.80
BSC.
BALL
PITCH
SD / SE
0.40 BSC.
SOLDER BALL PLACEMENT
---
DEPOPULATED
SOLDER
BALLS
