Cypress Semiconductor CY7C1338G, Specification Sheet

Page: 9 / 17

CY7C1338G
Document #: 38-05521 Rev. *D Page 9 of 17
Capacitance
[10]
Parameter Description Test Conditions
100 TQFP
Max.
119 BGA
Max. Unit
C
IN
Input Capacitance T
A
= 25°C, f = 1 MHz,
V
DD
= 3.3V.
V
DDQ
= 3.3V
5 5 pF
C
CLK
Clock Input Capacitance 5 5 pF
C
I/O
Input/Output Capacitance 5 7 pF
Thermal Resistance
[10]
Parameter Description Test Conditions
100 TQFP
Package
119 BGA
Package
Unit
Θ
JA Thermal Resistance
(Junction to Ambient) Test conditions follow standard test
methods and procedures for
measuring thermal impedance, per
EIA/JESD51. 30.32 34.1 °C/W
Θ
JC Thermal Resistance
(Junction to Case)
6.85 14.0 °C/W
AC Test Loads and Waveforms
Note:
10. Tested initially and after any design or process change that may affect these parameters.
OUTPUT
R = 317
Ω
R = 351
Ω
5 pF
INCLUDING
JIG AND
SCOPE
(a) (b)
OUTPUT
R
L
= 50
Ω
Z
0
= 50
Ω
V
T
= 1.5V
3.3V
ALL INPUT PULSES
V
DDQ
GND
90%
10%
90%
10%
≤
1 ns
≤
1 ns
(c)
OUTPUT
R = 1667
Ω
R =1538
Ω
5 pF
INCLUDING
JIG AND
SCOPE
(a) (b)
OUTPUT
R
L
= 50
Ω
Z
0
= 50
Ω
V
T
= 1.25V
2.5V
ALL INPUT PULSES
V
DDQ
GND
90%
10%
90%
10%
≤
1ns
≤
1ns
(c)
3.3V I/O Test Load
2.5V I/O Test Load