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CY7C1141V18, CY7C1156V18
CY7C1143V18, CY7C1145V18

Document Number: 001-06583  Rev. *D

Page 14 of 28

IDCODE

The IDCODE instruction causes a vendor-specific 32-bit code to
be loaded into the instruction register. It also places the
instruction register between the TDI and TDO pins and enables
the IDCODE to be shifted out of the device when the TAP
controller enters the Shift-DR state. The IDCODE instruction is
loaded into the instruction register upon power up or whenever
the TAP controller is supplied a test logic reset state.

SAMPLE Z

The SAMPLE Z instruction causes the boundary scan register to
be connected between the TDI and TDO pins when the TAP
controller is in a Shift-DR state. The SAMPLE Z command puts
the output bus into a High-Z state until the next command is
supplied during the Update IR state.

SAMPLE/PRELOAD

SAMPLE/PRELOAD is a 1149.1 mandatory instruction. When
the SAMPLE/PRELOAD instructions are loaded into the instruc-
tion register and the TAP controller is in the Capture-DR state, a
snapshot of data on the inputs and output pins is captured in the
boundary scan register. 

The user must be aware that the TAP controller clock can only
operate at a frequency up to 20 MHz, while the SRAM clock
operates more than an order of magnitude faster. Because there
is a large difference in the clock frequencies, it is possible that
during the Capture-DR state, an input or output undergoes a
transition. The TAP may then try to capture a signal while in tran-
sition (metastable state). This does not harm the device, but
there is no guarantee as to the value that is captured. Repeat-
able results may not be possible.

To guarantee that the boundary scan register captures the
correct value of a signal, the SRAM signal must be stabilized
long enough to meet the TAP controller's capture setup plus hold
times (t

CS

 and t

CH

). The SRAM clock input might not be captured

correctly if there is no way in a design to stop (or slow) the clock
during a SAMPLE/PRELOAD instruction. If this is an issue, it is
still possible to capture all other signals and simply ignore the
value of the CK and CK captured in the boundary scan register.

After the data is captured, it is possible to shift out the data by
putting the TAP into the Shift-DR state. This places the boundary
scan register between the TDI and TDO pins.

PRELOAD enables an initial data pattern to be placed at the
latched parallel outputs of the boundary scan register cells
before the selection of another boundary scan test operation.

The shifting of data for the SAMPLE and PRELOAD phases can
occur concurrently when required—that is, while data captured
is shifted out, shift the preloaded data in.

BYPASS

When the BYPASS instruction is loaded in the instruction register
and the TAP is placed in a Shift-DR state, the bypass register is
placed between the TDI and TDO pins. The advantage of the
BYPASS instruction is that it shortens the boundary scan path
when multiple devices are connected together on a board.

EXTEST

The EXTEST instruction enables the preloaded data to be driven
out through the system output pins. This instruction also selects
the boundary scan register to be connected for serial access
between the TDI and TDO in the shift-DR controller state.

EXTEST OUTPUT BUS TRI-STATE

IEEE Standard 1149.1 mandates that the TAP controller be able
to put the output bus into a tri-state mode. 

The boundary scan register has a special bit located at bit
number 47. When this scan cell, called the “extest output bus
tri-state”, is latched into the preload register during the
Update-DR state in the TAP controller, it directly controls the
state of the output (Q-bus) pins, when the EXTEST is entered as
the current instruction. When HIGH, it enables the output buffers
to drive the output bus. When LOW, this bit places the output bus
into a High-Z condition. 

Set this bit by entering the SAMPLE/PRELOAD or EXTEST
command, and then shifting the desired bit into that cell, during
the Shift-DR state. During Update-DR, the value loaded into that
shift-register cell latches into the preload register. When the
EXTEST instruction is entered, this bit directly controls the output
Q-bus pins. Note that this bit is preset HIGH to enable the output
when the device is powered up, and also when the TAP controller
is in the Test-Logic-Reset state. 

Reserved

These instructions are not implemented but are reserved for
future use. Do not use these instructions. 

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Summary of Contents for CY7C1141V18

Page 1: ...of two separate ports to access the memory array The read port has dedicated data outputs to support read operations and the write port has dedicated data inputs to support write operations QDR II ar...

Page 2: ...Reg Reg Reg 16 19 8 32 8 NWS 1 0 VREF Write Add Decode Write Reg 16 A 18 0 19 512K x 8 Array 512K x 8 Array 512K x 8 Array Write Reg Write Reg Write Reg 8 CQ CQ DOFF QVLD 512K x 9 Array CLK A 18 0 Gen...

Page 3: ...Reg 36 18 18 72 18 BWS 1 0 VREF Write Add Decode Write Reg 36 A 17 0 18 256K x 18 Array 256K x 18 Array 256K x 18 Array Write Reg Write Reg Write Reg 18 CQ CQ DOFF QVLD 128K x 36 Array CLK A 16 0 Gen...

Page 4: ...C VSS NC Q2 NC NC NC VREF NC NC VDDQ NC VDDQ NC NC VDDQ VDDQ VDDQ D1 VDDQ NC Q1 NC VDDQ VDDQ NC VSS NC D0 NC TDI TMS VSS A NC A NC D2 NC ZQ NC Q0 NC NC NC NC A NC 144M CY7C1156V18 2M x 9 2 3 4 5 6 7 1...

Page 5: ...5 NC NC VREF NC Q3 VDDQ NC VDDQ NC Q5 VDDQ VDDQ VDDQ D4 VDDQ NC Q4 NC VDDQ VDDQ NC VSS NC D2 NC TDI TMS VSS A NC A D7 D6 NC ZQ D3 Q2 D1 Q1 D0 NC A NC CY7C1145V18 512K x 36 2 3 4 5 6 7 1 A B C D E F G...

Page 6: ...nd write operations Internally the device is organized as 2M x 8 4 arrays each of 512K x 8 for CY7C1141V18 2M x 9 4 arrays each of 512K x 9 for CY7C1156V18 1M x 18 4 arrays each of 256K x 18 for CY7C1...

Page 7: ...m those listed in this data sheet For normal operation connect this pin to a pull up through a 10 K or less pull up resistor The device behaves in QDR I mode when the DLL is turned off In this mode op...

Page 8: ...rising edge of the Positive Input Clock K This enables for a seamless transition between devices without the insertion of wait states in a depth expanded memory Write Operations Write operations are i...

Page 9: ...ks are generated by the QDR II CQ is referenced with respect to K and CQ is refer enced with respect to K These are free running clocks and are synchronized to the input clock of the QDR II The timing...

Page 10: ...R CLKIN CLKIN D A K SRAM 4 RQ 250ohms ZQ CQ CQ Q K RPS WPS BWS D A K SRAM 1 RQ 250ohms ZQ CQ CQ Q K RPS WPS BWS RPS WPS BWS R 50ohms Vt V 2 DDQ R Notes 2 X Don t Care H Logic HIGH L Logic LOW represen...

Page 11: ...CY7C1141V18 only the upper nibble D 7 4 is written into the device D 3 0 remains unaltered CY7C1143V18 only the upper byte D 17 9 is written into the device D 8 0 remains unaltered H L L H During the...

Page 12: ...is written into the device D 8 0 and D 35 18 remains unaltered H L H H L H During the data portion of a write sequence only the byte D 17 9 is written into the device D 8 0 and D 35 18 remains unalter...

Page 13: ...falling edge of TCK Instruction Register Serially load three bit instructions into the instruction register This register is loaded when it is placed between the TDI and TDO pins as shown in TAP Cont...

Page 14: ...oundary scan register After the data is captured it is possible to shift out the data by putting the TAP into the Shift DR state This places the boundary scan register between the TDI and TDO pins PRE...

Page 15: ...gram 11 TEST LOGIC RESET TEST LOGIC IDLE SELECT DR SCAN CAPTURE DR SHIFT DR EXIT1 DR PAUSE DR EXIT2 DR UPDATE DR SELECT IR SCAN CAPTURE IR SHIFT IR EXIT1 IR PAUSE IR EXIT2 IR UPDATE IR 1 0 1 1 0 1 0 1...

Page 16: ...ut LOW Voltage IOL 100 A 0 2 V VIH Input HIGH Voltage 0 65 VDD VDD 0 3 V VIL Input LOW Voltage 0 3 0 35 VDD V IX Input and Output Load Current GND VI VDD 5 5 A 0 0 1 2 29 30 31 Boundary Scan Register...

Page 17: ...Hold after Clock Rise 5 ns tCH Capture Hold after Clock Rise 5 ns Output Times tTDOV TCK Clock LOW to TDO Valid 10 ns tTDOX TCK Clock LOW to TDO Invalid 0 ns TAP Timing and Test Condition The Tap Tim...

Page 18: ...Instruction Code Description EXTEST 000 Captures the input and output ring contents IDCODE 001 Loads the ID register with the vendor ID code and places the register between TDI and TDO This operation...

Page 19: ...2K 7 8P 34 11E 61 4B 88 1K 8 9R 35 10E 62 3A 89 2L 9 11P 36 10D 63 1H 90 3L 10 10P 37 9E 64 1A 91 1M 11 10N 38 10C 65 2B 92 1L 12 9P 39 11D 66 3B 93 3N 13 10M 40 9C 67 1C 94 3M 14 11N 41 9D 68 1B 95 1...

Page 20: ...power and clock K K for 2048 cycles to lock the DLL DLL Constraints DLL uses K clock as its synchronizing input The input must have low phase jitter which is specified as tKC Var The DLL functions at...

Page 21: ...l Impedance VDDQ 0 2 VDDQ V VOL LOW Output LOW Voltage IOL 0 1 mA Nominal Impedance VSS 0 2 V VIH Input HIGH Voltage VREF 0 1 VDDQ 0 15 V VIL Input LOW Voltage 0 15 VREF 0 1 V IX Input Leakage Current...

Page 22: ...ient Test conditions follow standard test methods and procedures for measuring thermal impedance in accordance with EIA JESD51 13 48 C W JC Thermal Resistance junction to case 4 15 C W AC Test Loads a...

Page 23: ...0 2 0 2 0 2 ns tCQDOH tCQHQX Echo Clock High to Data Invalid 0 2 0 2 0 2 ns tCQH tCQHCQL Output Clock CQ CQ HIGH 25 0 88 1 03 1 15 ns tCQHCQH tCQHCQH CQ Clock Rise to CQ Clock Rise 25 rising edge to...

Page 24: ...D A WPS RPS K K DON T CARE UNDEFINED CQ CQ tCQOH CCQO t tCQOH CCQO t tQVLD QVLD tQVLD Read Latency 2 0 Cycles CLZ t t CO tDOH tCQDOH CQD t tCHZ Q00 Q01 Q20 Q02 Q21 Q03 Q22 Q23 tCQH tCQHCQH Q Notes 30...

Page 25: ...Fine Pitch Ball Grid Array 13 x 15 x 1 4 mm Industrial CY7C1156V18 375BZI CY7C1143V18 375BZI CY7C1145V18 375BZI CY7C1141V18 375BZXI 51 85180 165 Ball Fine Pitch Ball Grid Array 13 x 15 x 1 4 mm Pb Fr...

Page 26: ...18 300BZXC CY7C1141V18 300BZI 51 85180 165 Ball Fine Pitch Ball Grid Array 13 x 15 x 1 4 mm Industrial CY7C1156V18 300BZI CY7C1143V18 300BZI CY7C1145V18 300BZI CY7C1141V18 300BZXI 51 85180 165 Ball Fi...

Page 27: ...5 M C B A 0 15 4X 0 35 0 06 SEATING PLANE 0 53 0 05 0 25 C 0 15 C PIN 1 CORNER TOP VIEW BOTTOM VIEW 2 3 4 5 6 7 8 9 10 10 00 14 00 B C D E F G H J K L M N 11 11 10 9 8 6 7 5 4 3 2 1 P R P R K M N L J...

Page 28: ...LIED WARRANTIES OF MERCHANTABILITY AND FITNESS FOR A PARTICULAR PURPOSE Cypress reserves the right to make changes without further notice to the materials described herein Cypress does not assume any...

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