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Cooper Tools GmbH, Carl-Benz-Str. 2, 74354 Besigheim, P.O. Box 1351
Germany, Tel: (07143) 580-0, Fax: (07143) 580108
For SMT components with a large number of pins with soldering connections around the outside such
as QFP, PLCC, etc., the component can be placed directly by means of lead-to-pad alignment.
The positioning unit is lowered onto the circuit board by pressing again the right button in the base frame.
After a time delay the vacuum will be switched off and the positioning unit is lifted upwards. The component
is now exactly placed on the circuit board.
With the aid of the operating lever (2), the placement head is raised, unlocked and moved away from the
working position. The component can now be soldered in place using the soldering head on the WQB 3000.
Positioning the circuit board:
The pad layout is exactly within the
red positioning frame F2
Positioning the component:
The component is within the yellow
positioning frame F1.
Component and circuit board are now
positioned accurately with respect to
each other.
