6. About Hardware
52
DIO-32DM3-PE
Table 6.1. Specifications < 2 / 2 >
Item
Specifications
Bus master section
DMA channels
2channels (one each for input and output)
Transfer bus width
64/32bit width
Transfer rate
360 MB/sec.
FIFO
4K data/ch.
Scatter/Gather function
2GB/ch.
Synchronization section
Control output signal
Selection of output signal with the software when specifying a sync master
board.
Control input signal
Selection of sync factor with the software when specifying sync slave boards.
Max. board count for
connection
16 boards including the master board
Common section
Allowable distance of signal
extension
1.5m (dependent on wiring environment)
Memory addresses
Occupies 2 locations 256MByte
Current consumption
3.3V 600mA (Max.) , 12V 30mA (Max.)
Operating conditions
0 - 50°C, 10 - 90%RH (No condensation)
Bus specification
PCI Express Base Specification Rev.2.0 x1
Physical dimensions (mm)
169.33(L) x 110.18(H)
Connector
PCR-equivalence to it
[mfd. by HONDA TSUSHIN KOGYO CO., LTD.]
Weight
150g
Standard
VCCI Class A, FCC Class A,
CE Marking (EMC Directive Class A, RoHS Directive)
External Board Dimensions
[mm]
The standard outside dimensions (L) is the distance
from the end of the board to the outer surface of the slot cover.
169.33(L)
11
0.
18
(H
)
Summary of Contents for DIO-32DM3-PE
Page 7: ...vi DIO 32DM3 PE ...
Page 17: ...1 Before Using the Product 10 DIO 32DM3 PE ...
Page 35: ...2 Setup 28 DIO 32DM3 PE ...
Page 47: ...3 External Connection 40 DIO 32DM3 PE ...
Page 57: ...5 About Software 50 DIO 32DM3 PE ...
Page 62: ......