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congatec
AG
TCEDm11
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4
Heatspreader
The heatspreader is thermally coupled to the CPU via a thermal gap filler and on some modules it may also be thermally coupled to other heat
generating components with the use of additional thermal gap fillers. Although the heatspreader is the thermal interface where most of the
heat generated by the module is dissipated, it is not to be considered as a heatsink. It has been designed as a thermal interface between the
module and the application specific thermal solution.
The application specific thermal solution may use heatsinks with fans, and/or heat pipes, which can be attached to the heatspreader. Some
thermal solutions may also require that the heatspreader is attached directly to the systems chassis thereby using the whole chassis as a heat
dissipater.
For additional information about the conga-TCA heatspreader, refer to section 4.1 of this document.
Caution
The congatec heatspreaders/cooling solutions are tested only within the commercial temperature range of 0° to 60°C. Therefore, if your
application that features a congatec heatspreader/cooling solution operates outside this temperature range, ensure the correct operating
temperature of the module is maintained at all times. This may require additional cooling components for your final application’s thermal
solution.
For adequate heat dissipation, use the mounting holes on the cooling solution to attach it to the module. Apply thread-locking fluid on the
screws if the cooling solution is used in a high shock and/or vibration environment. To prevent the standoff from stripping or cross-threading,
use non-threaded carrier board standoffs to mount threaded cooling solutions.
For applications that require vertically-mounted cooling solution, use only coolers that secure the thermal stacks with fixing post. Without the
fixing post feature, the thermal stacks may move.
Also, do not exceed the maximum torque specified for the cooling solution screws. Doing so may damage the module or/and the carrier
board.
Caution
Provide active airflow for the cooling fins of the conga-TCA/CSP-T(B) when you use the cooler on variants with PN: 047003 or PN: 047004.
The cooler cannot dissipate the heat generated by these modules without an active airflow.
