Copyright
©
2013
congatec
AG
TU87m10
20/108
4
Heatspreader
An important factor for each system integration is the thermal design. The heatspreader acts as a thermal coupling device to the module and
its aluminum plate is 4mm thick. The heatspreader is thermally coupled to the CPU and other heat generating components via a heat pipe.
Although the heatspreader is the thermal interface where most of the heat generated by the module is dissipated, it is not to be considered
as a heatsink. It has been designed to be used as a thermal interface between the module and the application specific thermal solution. The
application specific thermal solution may use heatsinks with fans, and/or heat pipes, which can be attached to the heatspreader. Some thermal
solutions may also require that the heatspreader is attached directly to the systems chassis thereby using the whole chassis as a heat dissipater.
For additional information about the conga-TC87 heatspreader, refer to section 4.1 of this document.
Caution
There are mounting holes on the heatspreader designed to attach the heatspreader to the module. These mounting holes must be used
to ensure that all components that are required to make contact with heatspreader do so. Failure to use these mounting holes will result in
improper contact between these components and heatspreader thereby reducing heat dissipation efficiency.
Attention must be given to the mounting solution used to mount the heatspreader and module into the system chassis. Do not use a threaded
heatspreader together with threaded carrier board standoffs. The combination of the two threads may be staggered, which could lead to
stripping or cross-threading of the threads in either the standoffs of the heatspreader or carrier board.
