CEFLA NewTom GO, Manual

Page: 61 / 76

EN OPERATOR'S MANUAL
61
9.5. PANORAMIC SENSOR CHARACTERISTICS(PAN)
For 2D machine only:
Sensitive area dimensions 6 x 151 mm
Resolution 5 lp/mm (PAN projection)
Primary screen > 0.5 mm Pb
Pixel size 100μm
Sensor technology CMOS
Scintillator material & type Direct deposition CsI
MTF 58% @ 1 lp/mm
DQE 70% @ 0 lp/mm
Sensor matrix dimensions 1.512 x 60
Gray level 14 bit
Magnification (PAN) 1.25 ±5%
Connection Gigabit Ethernet
For 3D machine only (in 2D mode):
Sensitive area dimensions 6 x 146 mm
Resolution 5 lp/mm (PAN projection)
Pixel size 127 µm
Sensitive area dimensions 6 x 146 mm
Sensor technology Amorphous silicon
Scintillator material & type Direct deposition CsI
MTF 55% @ 1 lp/mm
DQE 70% @ 0 lp/mm
Sensor matrix dimensions 1152 x 48 pixels
Gray level 16 bit
Magnification (PAN) 1.25 ±5%
Connection Gigabit Ethernet
9.6. 3D PANEL FEATURES
For 3D machine only:
Sensitive area dimensions 146x146 mm
Resolution 3.94 LP/mm
Pixel size 127 x 127 µm
Sensor technology Amorphous silicon
Scintillator material & type Direct deposition CsI
MTF 57% @ 1lp/mm (1x1)
DQE 70% @ 0lp/mm (1x1)
Image pixels 1152 x 1152 pixels
Pixel depth 16 bit
Max Full Field 1x1 Frame Rate 28 fps
Connection Gigabit Ethernet
Voxel size Standard Resolution: 80-115-150 µm
HiRes: 160-230-300 µm
9.7. LASER CHARACTERISTICS
Optical power Class 1 according to IEC 60825-1: 2003
Laser power Max 3mW
Diffractive optics Aspheric lens; linear shape; 58° opening
Wave length 635-650 nm
Activation time Continuous wave; Timing limited to 30”