4. With the oscillating frame still mo-
ving and the recifier switched on and
preset and the air agitation switched on
you now fix the board over the galva-
nic plating bath.
Adjust correct current immediately
(without current you risk to etch off all
catalyst applied). Standard working
current setting is 3 A / dm². Example:
Board size 200 x 300mm = 6 dm², 3
A / dm² x 2 sides at 6 dm² = 3 x 2 x 6
= 36 A.
Every minute in the copper plating
bath will apply 0,7µm copper. Examp-
le: 18µm copper will be applied in 26
minutes of copper plating.
Adjust timer accordingly and leave
board in the plating bath as long as
necessary.
After that rinse carefully and dry the
board immediately to avoid oxidisati-
on.
Replenishment
Once your baths have been initially
made up, they can be easily replenis-
hed by simply adding the appropriate
product. See the instructions on the
following Plating System Step descrip-
tions. Missing replenishment will spoil
Bath maintenance
The Analysis procedures in the Plating
System Step descriptions are for expert
use only. This is to say the bathes
maintain stable and working also wit-
hout analyses, only by replenishment.
The Analysis procedures are given for
reference of expert users - who have
access to the appropriate measuring
devices.
For further information or help please
give us your fax or e-mail message
including your machine serial number
and detailed problem description. We
will help immediatly. Spare parts are
supplied with the understanding that
only qualified person will repair the
unit.
(C) 6/2002 Bungard Elektronik
Bungard Elektronik GmbH&Co KG· Rilke Str. 1 · D-51570 Windeck
Tel 02292 5036 · Fax 6175 · [email protected]
Compacta L30
Instructions for use
Plating line
Page 7
