Hardware User Manual - Sentis3D-M530
Last change: 27 April 2016
Version
2
Bluetechnix ©
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4
Hardware installation
4.1
Mounting
The Sentis3D-M530-Baseboard provides 4 x M3 mounting holes to fix it on the enclosure. The positions of
the mounting holes is shown in figure 7.1 (3.2mm holes).
Note:
The mounting holes must be electrically connected to the enclosure using metallic screws!
The LIM modules mounted on the Sentis3D-M530-Baseboard must be fixed to a heatsink or to the
enclosure. For more information about the LIM modules see the Hardware User Manual of the LIM-U-LED-
850 available from Bluetechnix website. The mounting holes are also visible on the 3D STEP model of the
Sentis3D-M530 camera.
Note:
Gap pads must be used to electrically isolate the LIM module cooling area from the heatsink
or enclosure!
The TIM module can also be fixed on the enclosure using the top two M2 holes available on the module. The
mounting holes are also visible on the 3D STEP model of the Sentis3D-M530 camera.
4.2
Cooling areas
The Sentis3D-M530 must be cooled at several areas to ensure valid operation conditions. The most
important cooling areas are:
-
LIM modules: each LIM module produces up to 20W of dissipation power that must be cooled
mounting a heatsink/enclosure and a gap pad on the bottom of the module (red areas in Figure 4-1).
The power is valid only during integration phase. Based on integration time and frame-rate the
average power may be less.
-
CM-i.MX6Q: the processor module produces up to 5W of dissipation power. The main heat sources
are the i.MX6Q processor (left dark region in orange area in Figure 4-1) and the PMIC (right dark
region in orange area in Figure 4-1).
