17
AT24C16C [DATASHEET]
Atmel-8719D-SEEPROM-AT24C16C-Datasheet_122016
13.3 8X — 8-lead TSSOP
DRAWING NO.
REV.
TITLE
GPC
COMMON DIMENSIONS
(Unit of Measure = mm)
SYMBOL
MIN
NOM
MAX
NOTE
A - -
1.20
A1 0.05 - 0.15
A2 0.80
1.00
1.05
D 2.90
3.00
3.10
2,
5
E
6.40
BSC
E1 4.30
4.40
4.50
3,
5
b
0.19
0.25
0.30
4
e
0.65 BSC
L
0.45
0.60
0.75
L1
1.00
REF
C 0.09 -
0.20
Side View
End View
Top View
A2
A
L
L1
D
1
E1
N
b
Pin 1 indicator
this corner
E
e
Notes:
1. This drawing is for general information only.
Refer to JEDEC Drawing MO-153, Variation AA, for proper
dimensions, tolerances, datums, etc.
2. Dimension D does not include mold Flash, protrusions or gate
burrs. Mold Flash, protrusions and gate burrs shall not exceed
0.15mm (0.006in) per side.
3. Dimension E1 does not include inter-lead Flash or protrusions.
Inter-lead Flash and protrusions shall not exceed 0.25mm
(0.010in) per side.
4. Dimension b does not include Dambar protrusion.
Allowable Dambar protrusion shall be 0.08mm total in excess
of the b dimension at maximum material condition. Dambar
cannot be located on the lower radius of the foot. Minimum
space between protrusion and adjacent lead is 0.07mm.
5. Dimension D and E1 to be determined at Datum Plane H.
Package Drawing Contact:
8X
E
2/27/14
8X, 8-lead 4.4mm Body, Plastic Thin
Shrink Small Outline Package (TSSOP)
TNR
C
A1
