21
AT24C16C [DATASHEET]
Atmel-8719D-SEEPROM-AT24C16C-Datasheet_122016
13.7 8U3-1 — 8-ball VFBGA
DRAWING NO.
REV.
TITLE
GPC
Package Drawing Contact:
8U3-1
F
6/11/13
8U3-1, 8-ball, 1.50mm x 2.00mm body, 0.50mm pitch,
Very Thin, Fine-Pitch Ball Grid Array Package (VFBGA)
GXU
COMMON DIMENSIONS
(Unit of Measure - mm)
SYMBOL
MIN
NOM
MAX
NOTE
A 0.73
0.79
0.85
A1 0.09
0.14
0.19
A2 0.40
0.45
0.50
b
0.20 0.25 0.30 2
D
1.50 BSC
E
2.0 BSC
e
0.50 BSC
e1 0.25 REF
d
1.00 BSC
d1 0.25 REF
1. This drawing is for general information only.
2. Dimension ‘b’ is measured at maximum solder ball diameter.
3. Solder ball composition shall be 95.5Sn-4.0Ag-.5Cu.
Notes:
A2
SIDE VIEW
A
PIN 1 BALL PAD CORNER
TOP VIEW
E
D
A1
b
8 SOLDER BALLS
BOTTOM VIEW
(d1)
d
4
3
2
(e1)
6
e
5
7
PIN 1 BALL PAD CORNER
1
8
2.