R·I·T
Title: ASML Stepper
Semiconductor & Microsystems
Fabrication Laboratory
Revision: B Rev Date: 12/21/2010
RIT SMFL
Page 9 of 11
8.1.9
Input the Nominal Energy, the Energy Increment and the Window Size. Be sure
to hit return after each entry.
8.1.10
Select Accept.
8.1.11
One wafer will be exposed with the nominal exposure in the center of the wafer. The
remaining exposures will be divided up above and below this. When the wafer is
finished, a report will come up and show the exposure pattern.
8.1.12
When finished select Exit twice to return to the Main Menu.
8.1.13 A dose to clear test can also be done in the screen used to define a batch.
8.2
FEM (Focus/ Exposure Matrix)
8.2.1 From the Main Menu select 6-Test Manage.
8.2.2 Select 1-Run Test.
8.2.3 Move to the top of the directory by clicking Up.
8.2.4 Select Projection Systems.
8.2.5 Select FEM Developer/Customer.
8.2.6 Select Accept at the top of the screen.
8.2.7 Input desired values for matrix size, energy, increment, focus and the number of die
to be exposed. Each die is a complete focus/ exposure matrix.
8.2.8 Select Accept.
8.2.9 When finished select Exit twice to return to the Main Menu.
8.2.10 A Focus/Exposure test can also be done in the screen used to define a batch.
8.3
Running RIT Daily
8.3.1 From the Main Menu select 6-Test Manager.
8.3.2 At the top of the dialog screen select CMD HDL.
8.3.3 From this screen select 8-Contamination and Temperature Control.
