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R·I·T

                                              Title: ASML Stepper 

Semiconductor & Microsystems                           
Fabrication Laboratory

 

RevisionB                            Rev Date: 12/21/2010

 

 
Approved by: 
                                   /    /                                                     /    /           
    Process Engineer                            Equipment Engineer                                                                               
 

RIT SMFL 

 

Page 1 of 11 

 

  

1

 

SCOPE 

 
The purpose of this document is to detail the use of the ASML PAS 5500 Stepper.  All users are expected 
to have read and understood this document.  It is not a substitute for in-person training on the system and 
is not sufficient to qualify a user on the system.  Failure to follow guidelines in this document may result 
in loss of privileges.   
 

2

 

REFERENCE DOCUMENTS 

 

Batch Control PAS 5500 Training Module 
Reticle Design Manual 
PAS 5500 User Guide 
PAS 5500 Job Definition 
PAS Global Alignment Strategies 
PAS 5500 Steppers up to and including /300 Stepper Introduction 

 

3

 

DEFINITIONS 

 

n/a 

 

4

 

TOOLS AND MATERIALS

 

 

4.1

 

General Description - The ASML PAS 5500/200 is a 5x reduction, i-line stepper set up for 
exposure  of  6  inch  wafers  using  6  inch  reticles.    The  system  has  350nm  resolution  with  a 
0.48-0.60 variable numerical aperture.  The maximum field size on the wafer is 22x22mm.  
Overlay  capability  is  better  than  50nm.    All  lithography  levels  for  a  particular  design  are 
included in a single stepper job.   

 
 
 
 
 
 
 
 
 

Summary of Contents for PAS 5500

Page 1: ...ment may result in loss of privileges 2 REFERENCE DOCUMENTS Batch Control PAS 5500 Training Module Reticle Design Manual PAS 5500 User Guide PAS 5500 Job Definition PAS Global Alignment Strategies PAS 5500 Steppers up to and including 300 Stepper Introduction 3 DEFINITIONS n a 4 TOOLS AND MATERIALS 4 1 General Description The ASML PAS 5500 200 is a 5x reduction i line stepper set up for exposure o...

Page 2: ...nment Marks are aligned to the permanent fiducial marks F1 and F2 located on the fiducial plate on the wafer table 4 5 Wafer Zero Level The ASML Stepper utilizes zero level marks that are patterned and etched into the wafer before any other steps An etch depth of 1200A 10 allows the stepper to recognize the marks It is possible to pattern the zero level at the same time as the first level but over...

Page 3: ... 5 1 1 The ASML uses ultraviolet light as well as lasers and should only be operated with all of the covers closed Safety glasses should be worn at all times 5 1 2 The ASML stepper had mechanical hazards Do not operate with open covers and do not open any covers during operation 5 2 Hazards to the Tool 5 2 1 Never open or service the wafer stage since serious damage to the tool can occur 5 2 2 Nev...

Page 4: ...te 12 21 2010 RIT SMFL Page 4 of 11 6 INSTRUCTIONS 6 1 Starting the System 6 1 1 Swipe the tool in on the Card Swipe System 6 1 2 Verify that the computer is on 6 1 3 Make sure that the computer is on the Main Menu if not select 0 Exit Do not exit from the Main Menu Unload Load Reticle Changer ...

Page 5: ... a 45 degree angle Always support the reticle box on the bottom to prevent reticles from falling out 6 2 3 Carefully open the reticle box The clear top is released from the base by sliding the 4 clamps underneath the base Load the reticles chrome side down with the pre alignment stars facing out Never touch the surface of a reticle Close the reticle box and make sure it is secured before lifting D...

Page 6: ...rol and 1 Define Batch 6 4 2 The Batch ID is the name that you use to identify your wafers 6 4 3 The Job Name is the name of the stepper job that you want to use Click the Select button scroll down select the job and Accept at the top of the screen Writing a stepper job is detailed in a separate document 6 4 4 Click on the line to the right of Layer ID Select the Layer Number that you want to expo...

Page 7: ...is not fully raised 6 5 2 Place the empty cassette back on the tool All 4 stations should have a cassette 6 6 Unloading Reticles 6 6 1 To remove the reticle box from the machine under Main Menu select Mat Hdl from the top of the screen and then 3 Exchange Reticle Box Click the Unlock button in the middle of the screen to unlock the reticle box 6 6 2 Remove the box by lifting straight up 2 cm tilti...

Page 8: ...Process Data in your stepper job to enter a layer shift in microns See Section 6 8 of the ASML PASS 5500 Job Creation Manual 7 APPROPRIATE USES OF THE TOOL 7 1 No backside coated wafers only wafers with clean backs may be processed in this tool 7 2 No polyimide or SU8 may be processed in this tool 8 ATTACHMENTS 8 1 Dose to Clear Test Exposure Matrix 8 1 1 This test is done with or without a mask a...

Page 9: ...he screen used to define a batch 8 2 FEM Focus Exposure Matrix 8 2 1 From the Main Menu select 6 Test Manage 8 2 2 Select 1 Run Test 8 2 3 Move to the top of the directory by clicking Up 8 2 4 Select Projection Systems 8 2 5 Select FEM Developer Customer 8 2 6 Select Accept at the top of the screen 8 2 7 Input desired values for matrix size energy increment focus and the number of die to be expose...

Page 10: ...est Que 8 3 10 Select Select 8 3 11 Scroll down until you see daily RIT Characters are case sensitive 8 3 12 Select Accept at the top of the screen 8 3 13 Select Accept again and the test will run 8 3 14 Select Exit twice to return to the Main Menu 8 4 Procedure for Creating a Zero Level 8 4 1 Load the Combi Reticle 8 4 2 Select your stepper job 8 4 3 Select Layer ID 8 4 4 Select Zero Layer to exp...

Page 11: ...rosystems Fabrication Laboratory Revision B Rev Date 12 21 2010 RIT SMFL Page 11 of 11 REVISION RECORD Summary of Changes Originator Rev Date Original Issue Sean O Brien A 07 20 2010 Clarified some of the instructions Sean O Brien B 12 21 2010 ...

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